1-2 of 2
Keywords: stacking yield model
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
... related to PoP stacking yield. It has been known [ 2 – 7 ] that the noncontact open is the most dominant factor to the yield loss. stacking yield model package-on-package approximate integration-based scheme probability density function warpage 04 03 2019 25 04 2019...
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
Open the PDF for Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development in another window
Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
... . Manuscript received March 4, 2019; final manuscript received June 20, 2019; published online August 1, 2019. Assoc. Editor: Kaushik Mysore. 04 03 2019 20 06 2019 stacking yield model package-on-package approximate integration-based scheme probability density function warpage...
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
Open the PDF for Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model in another window
Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints