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Keywords: statistical analysis
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021013.
Paper No: EP-13-1015
Published Online: June 1, 2015
... statistical analysis Die-attach solder voids are cavities within the solder bonding layer between an IC die and a substrate formed during a solder-reflow process. The voids are common defects wherever solder paste is adopted to implement die-attach processes in assembling IC packages. The defects may...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031002.
Published Online: June 16, 2009
... strength and determining the strength of the leadframe are important in order for the package to obtain higher reliability. Commonly, an epoxy material is used in the die attachment process for die adherence onto the leadframe. A statistical analysis of the die shear test and the cyclic strain test...