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Keywords: statistical analysisClose
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021013.
Paper No: EP-13-1015
Published Online: June 1, 2015
... statistical analysis Die-attach solder voids are cavities within the solder bonding layer between an IC die and a substrate formed during a solder-reflow process. The voids are common defects wherever solder paste is adopted to implement die-attach processes in assembling IC packages. The defects may...
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
Published Online: June 7, 2011
... materials oxidation particle size polymers Raman spectroscopy scanning electron microscopy statistical analysis thermal conductivity thermal management (packaging) graphite nanoplatelet (GNP) thermal interface materials particle size polymer composites thermal properties...
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031002.
Published Online: June 16, 2009
... strength and determining the strength of the leadframe are important in order for the package to obtain higher reliability. Commonly, an epoxy material is used in the die attachment process for die adherence onto the leadframe. A statistical analysis of the die shear test and the cyclic strain test...