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Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031001.
Paper No: EP-23-1070
https://doi.org/10.1115/1.4064354
Published Online: January 8, 2024
...Y. W. Wang; M. Y. Tsai; Y. S. Chou A relatively low-cost and easy-to-use strain gauge measurement is proposed here as an alternative method for simultaneously determining the thermally induced warpages and the coefficients of thermal expansion (CTEs) of the flip-chip packages with a cap (or lid...
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Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping