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Keywords: substrates
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021002.
Published Online: March 27, 2009
...Yi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021005.
Published Online: April 25, 2008
... micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
Published Online: January 31, 2008
...Yung-Shin Tseng; Tzu-Chen Hung; Bau-Shei Pei In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
Published Online: March 15, 2007
...Fang Liu; Guang Meng; Mei Zhao Dynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are macromolecule resins, which are typical viscoelastic materials. From...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 125–129.
Published Online: October 11, 2005
... processes and, therefore, their microstructures as well as the practical difficulties in measuring small temperature gradients during the characterization. In this paper, we will report on a novel film on substrate technique that can be used conveniently for repeated measurements of the lateral thermal...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
Published Online: March 21, 2005
... pitch applications. This work deals with adhesion issues between ACA on polyimide materials. The paper presents a reliability assessment of adhesive joints using ACA on polyimide substrate that was conducted by testing samples at various aging temperature, high humidity and high pressure environments...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
Published Online: December 15, 2003
...John H. Lau; Stephen H. Pan In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 313–318.
Published Online: September 17, 2003
...Tapani M. Alander; Pekka A. Heino; Eero O. Ristolainen Electrically conductive substrates (i.e., metals) are often used in the mounting of semiconductor laser diodes. While metals offer a good electrical and thermal performance, they restrict the system integration due to lack of signal routing...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 334–339.
Published Online: December 12, 2002
... 12 12 2002 chip scale packaging failure analysis reliability substrates organic compounds moisture delamination moulding BT Substrate PCT (Pressure Cooked Test) Mold Compound Moisture Uptake CSP(Chip Scale Package) Failure Mechanism Reliability For the current...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
Published Online: December 29, 1999
...Anh X. H. Dang; I. Charles Ume; Swapan K. Bhattacharya This paper presents potential application of stainless steel (SS) as a base substrate material for large area multi-chip module-deposited (MCM-D) packaging. Preliminary results on via formation on SS substrates by laser drilling, dielectric...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 77–85.
Published Online: November 22, 1999
...Anh X. H. Dang; I. Charles Ume; Swapan K. Bhattacharya Potential application of stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 in. thick and 12 in.×12 in. SS panel with laser drilled 0.01...