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Keywords: surface morphology
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 71–75.
Published Online: May 12, 2006
... test accelerates the creep strain rate due to the diffusive flow, relatively. 14 11 2005 12 05 2006 solders deformation indentation creep testing surface morphology stress relaxation finite element analysis Tin-based alloys are commonly used in microelectronics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
.... The smooth surface of the UBM leads to a better shear strength with only a minimum Al dissolved. 03 04 2005 29 11 2005 electronics packaging electroless deposition bonding processes surface topography surface morphology adhesion solders scanning electron microscopy X-ray chemical...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity ACF...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
Published Online: July 8, 2004
... 4024) and the damage mechanism of interconnect bump with BCB bumping dielectrics upon temperature cycling. Adhesion and fracture surface morphology after die shear testing show that the weakening and delamination of BCB passivation layer at the die corner is the main cause of the reduction of die...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding In recent years, the rapid market growth in portable and hand-held products challenges the electronic packaging industry...