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Keywords: surface roughness
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
Published Online: September 24, 2019
... resistance (R) can be reduced from 6.5–8.2 K ⋅ m ⋅ W −1 to 0.004–0.013 K ⋅ m ⋅ W −1 . The improvement is far superior to existing studies. Besides, decreasing the surface roughness and increasing contact pressure also help to reduce R, especially for the cases when the LMTA is not melted. As the LMTA melts...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
...K. N. Prabhu; G. Kumar The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn–37Pb, Sn–3.5Ag, and Sn–9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
Published Online: February 6, 2006
... on the surface roughness. Accordingly, these two methods can provide not only a (biaxial) stress field similar to temperature-loaded die in the packages, but also simple, feasible, reliable, and chipping-free tests for silicon dies of dummy or real IC chips, without strict geometrical limitation, such as beam...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
Published Online: December 24, 2005
... occurs at the location near the rim of the heat spreader. The effect of surface roughness on both local and average natural convective heat transfer behaviors from nominally flat silicon-based spreader surfaces to the external ambient is not significant. Two new generalized correlations of local...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 357–361.
Published Online: August 5, 2004
...Xiang-Qi Wang; Christopher Yap; Arun Sadashiv Mujumdar The friction factors of single-phase microchannel with various roughness elements (rectangular, triangular, elliptical) were investigated numerically. The two-dimensional numerical solution shows significant influence of surface roughness...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
Published Online: April 30, 2004
... ° C ) , and combinations of these two methods were examined to investigate the wafer cleaning effect. When wafers were cleaned by RCA after SPM cleaning, maximal bonding quality at room temperature was gained. Surface roughness, as measured by AFM (atomic force microscope), was found to correspond...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
...Neil McLellan; Nelson Fan; Shilai Liu; Kim Lau; Jingshen Wu A systematic investigation on the effects of wafer thinning process on the surface roughness, morphology and fracture strength of silicon chips was conducted. The results of the study suggest that the fracture strength of the silicon chips...