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Keywords: surface tension
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031005.
Published Online: September 9, 2010
...Koji Fumoto; Masahiro Kawaji; Tsuyoshi Kawanami This paper discusses a pulsating heat pipe (PHP) using a self-rewetting fluid. Unlike other common liquids, self-rewetting fluids have the property that the surface tension increases with temperature. The increasing surface tension at a higher...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
Published Online: February 12, 2008
... by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain software called SURFACE EVOLVER and the three-dimensional geometry of solder joint with different...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 48–55.
Published Online: May 13, 2006
... by surface tension, the pressure difference between the inlet and the outlet is established using a pump or a vacuum, and the inertia force is achieved via circular rotation. The governing equations containing the three analyzed effects are derived and solved using a dimensionless technique. The analytical...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 331–338.
Published Online: September 29, 2005
.... As a result, the coordinates of each node of the arc and the solder joint geometry can be determined in turn. The factors that affect the final shape of the molten eutectic solder joints, including the solder volumes, external loading, pad size, surface tension of molten eutectic solder, and interfacial...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
Published Online: March 21, 2005
...Jong-Min Kim; Kiyokazu Yasuda; Kozo Fujimoto We have demonstrated the self-alignment processes using surface tension of the resin material for the self-assembly systems. It has been known that the surface tension of the resin material is too low to achieve the self-alignment capability. This paper...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
Published Online: October 5, 2004
... and reflow. The final shape of the solder joint is a function of surface tension, wetting area, gravity, and applied forces. In this paper, a new methodology to simulate solder joint shape is presented. Large deformation viscoplastic finite element analysis is used to simulate incompressible fluid flow...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 22–25.
Published Online: April 30, 2004
... the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated. assembling forming processes surface tension wetting soldering...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 52–56.
Published Online: April 30, 2004
...L. L. Meekisho, Mem. ASME,; K. Nelson-Owusu, Mem. ASME, The final shape of a solidified solder fillet joint from a reflow process is determined by process parameters and the solder alloy’s physical properties, including surface tension, density, gravity, and wetting angles. This work investigates...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
Published Online: December 15, 2003
... as water droplets, surface tension can induce a piezoresistive stress effect that causes an unacceptable voltage shift. Finite element analyses were performed to simulate the phenomenon and the results correlated well with experimental observations. The authors would like to thank Dr. Anthony Polak...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
Published Online: September 17, 2003
...Ronald L. Panton, Fellow ASME; Jong W. Lee; Lakhi Goenka; Achyuta Achari This research studies the motion of void bubbles within molten solder bumps. Surface tension variation on the outer surface of the bump drives a flow that is transmitted to the interior by viscosity. Bubbles inside the bump...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 227–233.
Published Online: July 26, 2002
... for metallography. This project was supported in part by NIST’s Advanced Technology Program. The motivation for this study was a need to assess the validity of using only static surface tension theory for use in understanding flip-chip misalignment. The qualitative and quantitative agreement...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 37–44.
Published Online: August 18, 1999
...), or C4 type solder joints. The reflow process involves several design factors capable of influencing the final shape of the molten solder joint, such as solder joint volume, restoring force, surface tension, contact angle, pad thickness, and pad size. These factors are all considered in the calculations...