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Keywords: temperature control
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... the benefits of any data center design and operational strategies seeking to improve efficiency, such as temperature controlled fan algorithms. Using the models previously developed by the authors, this paper extends the analysis to include the electronics within the rack through considering the processor heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
Published Online: October 21, 2009
...A. D. Laws; R. Borwick, III; P. Stupar; J. DeNatale; Y. C. Lee The power dissipation for chip-scale atomic clocks (CSAC) is one of the major design considerations. 12 mW of the 30 mW power budget is for temperature control of the vertical-cavity-surface-emitting laser (VCSEL) and the alkali-metal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031012.
Published Online: August 12, 2008
... increase. With power densities approaching 100 W / cm 2 , the current passive control systems are no longer able to maintain the required temperature tolerance for production testing. This paper describes the design and testing of a temperature control system that combines high performance impingement...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021011.
Published Online: May 15, 2008
... cell, contained in the clock, must be maintained at 70 ± 0.1 ° C even under an ambient temperature variation of − 40 ° C to 50 ° C . A thermal test vehicle has been developed to characterize a sample package with a thermal conduction switch. Three cases are presented for the temperature control...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 137–144.
Published Online: November 11, 2005
.... Comparing the minimum of configuration 1 with the standard CRAC return air temperature control method, it is possible to reduce CRAC power consumption by 65% and still maintain thermal management in this data center. The results indicate...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
..., Upper Saddle River, NJ, Chap. 1, p. 6. Haberman, C., 1998, Elementary Applied Partial Differential Equations , Prentice–Hall, NJ, 3rd ed., Chap. 2, pp. 40–66. integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures...