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Keywords: temperature profile
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Journal Articles
Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011005.
Paper No: EP-24-1049
Published Online: July 16, 2024
...Rilwan Kayode Apalowo; Mohamad Aizat Abas; Muhamed Abdul Fatah Muhamed Mukhtar; Mohamad Riduwan Ramli This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021006.
Paper No: EP-19-1070
Published Online: March 9, 2020
... reduced processing temperature (at least 150 °C lower than traditional techniques) and minimal thermal effects to the components. In this study, finite element analysis was performed to predict the temperature profiles across bonding interfaces, which were subsequently correlated with the formation...
