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Keywords: thermal diffusion
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
... 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
Published Online: August 19, 2007
..., this value can vary greatly with film fabrication and poling processes, and its measurement is often highly coupled to the material’s thermal diffusivity. This paper describes a new approach to film characterization that combines the popular “ 3 - omega ” technique for thermal characterization...