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Keywords: thermal fatigue life
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041007.
Paper No: EP-13-1018
Published Online: November 5, 2013
... of China (NSFC) under the Grant Nos. 10572010 and 10972012. (1) The CTE of EMC, the height of solder joint and the CTE of PCB board are the significant factors to affect the thermal fatigue life of solder joints. (2) The fatigue life of multirow QFN package with original design is 767 cycles...