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Keywords: thermal fatigue life
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041007.
Paper No: EP-13-1018
Published Online: November 5, 2013
... on thermal fatigue life of solder joints. The fatigue life of multirow QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after the optimized factor combination design based on the presented method. electronics package numerical simulation...
