... inside the motor. In order to improve thermal management, a multiphysics modeling framework that is able to accurately predict the behavior of the motor, while being computationally efficient, is essential. This paper first presents a detailed validation of a lumped parameter thermal network (LPTN) model...

... in thermal management [ 5 ]. PCMs absorb heat at a constant temperature during a change in phase [ 6 ]. PCM incorporated into PE packaging can effectively store heat dissipated by the devices during its transient operation via phase change from solid to liquid (or in some cases solid to solid...

... ], and the manufacturing of biological products [ 14 ]. In cooling technologies, evaporation is becoming increasingly important as technical advances in micro- and power-electronics exacerbate thermal management challenges. The next generation of high-powered electronics will have heat densities exceeding 1000 W/cm 2...

... for an extensive range of thermal-management applications, ranging from aerospace, spacecraft, and smart-building construction materials, to electronics protection, electronics packaging, refrigeration, thermal control during energy harvesting, thermal isolation, etc. A vital factor for tuning the diodicity...

... successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects...

... mechanisms that are adapted and optimized for the time constants and needs of the specific application. It is the intent of this transient thermal management review to describe a wide range of areas in which transient thermal management for electronics is a factor of significance and to illustrate which...

...), combined with a desire to miniaturize, the challenge of removing enough heat from electronic devices in automotive vehicles is evolving. This paper closely examines the new challenges in thermal management in various driving environments and aims to classify each existing cooling method in terms...

... Government purposes. 11 01 2020 12 04 2020 21 05 2020 gallium nitride (GaN) high electron mobility transistor (HEMT) power electronics Raman thermometry self-heating thermal dynamics thermal management thermoreflectance thermal imaging wide bandgap (WBG) Wide bandgap...

...Yogesh Fulpagare; Atul Bhargav; Yogendra Joshi With the explosion in digital traffic, the number of data centers as well as demands on each data center, continue to increase. Concomitantly, the cost (and environmental impact) of energy expended in the thermal management of these data centers...

... 2019 power electronics thermal management direct bonded copper channels single-phase cooling jet impingement computational fluid dynamics (CFD) Power electronic components are widely used in applications from high voltage electric grid power management to low-voltage battery...

... of contained cold aisle systems flow distribution, it is crucial that physics based models of fan curves, server internal resistances, detailed rack models, and other design details are all accurate and experimentally verified. CFD thermal management data center cold aisle containment fan curves...

... Circuits ,” IEEE Trans. Device Mater. Reliab. , 4 ( 4 ), pp. 709 – 714 . 10.1109/TDMR.2004.840160 [2] McGlen , R. J. , Jachuck , R. , and Lin , S. , 2004 , “ Integrated Thermal Management Techniques for High Power Electronic Devices ,” App. Therm. Eng. , 24 ( 8–9 ), pp. 1143 – 1156...

... and reliability challenges for circuit components, multiple levels of interconnections and packaging, and adversely impact overall power efficiencies. Runtime temperature calculations would be beneficial to architectures with dynamic thermal management, which control hotspots by effectively optimizing regional...

... January 21, 2013; published online March 28, 2013. Assoc. Editor: Siddharth Bhopte. 13 07 2012 21 01 2013 Currently, the thermal management of microelectromechanical systems (MEMS) has become a challenge. In the present research, a micro pulsating heat pipe (MPHP) with a hydraulic...

.... The main enabler of 3D integration is through-silicon-vias (TSVs) and stacking of multiple dies. Irrespective of these advantages, thermal management in 3D stacks poses significant challenges for the implementation of 3D integrated circuits. Even though extensive research work has been done...

...Peipei Li; Jing Liu Thermal management has been a critical issue for the safe running of an electronic device. Driving liquid metal with low melting point to extract heat from the thermal source is highly efficient because of its superior thermophysical properties over conventional coolant...

... microprocessor chips temperature control thermal resistance Data center cooling thermal management chip to cooling tower energy efficiency heat sink © 2010 IEEE. Reprinted with permission from the “12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic...

... engineering DP industry gallium alloys liquid metals thermal resistance liquid metal cooling electromagnetic pump high performance CPUs heat transfer enhancement thermal management chip cooling The last five decades have witnessed great prosperity and development of very large scale...

... analysis heat pipes heat sinks semiconductor device packaging heat transfer heat flux centrifugal fan circular stacked heat sink finite element analysis embedded heat pipe diamond copper composite thermal resistance semiconductor chip thermal management A cooling device using...

...Amip J. Shah; Van P. Carey; Cullen E. Bash; Chandrakant D. Patel Chip power consumption and heat dissipation have become important design issues because of increased energy costs and thermal management limitations. As a global compute utility evolves, seamless connectivity from the chip to the data...