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Keywords: thermal stability
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
Published Online: May 13, 2020
... of these materials under repetitive melting solidification cycles. The results of the effect of cyclic thermal loading of theses alloys on the melting behavior and latent heat of fusion are discussed. Thermal stability of 51.0 wt % In–32.5 wt %Bi–16.5 wt %Sn and 50 wt %Bi–26.7 wt %Pb–13.3 wt %Sn–10 wt %Cd alloys...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
.... 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... for the open defect; insufficient heating in the solder melting phase, poor thermal stability of PCB and PBGA and insufficient amount of printing solder paste. Based on the defect mechanism analysis, by optimizing the soldering process, very high assembly yield was achieved. The difference of standoff height...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 309–311.
Published Online: June 26, 2000
.... Contributed by the Electronic and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the EPPD June 26, 2000. Associate Editor: R. Wirtz. 26 June 2000 thermal stability thermal conductivity thermal management (packaging) Thermal...
Journal Articles
Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
Published Online: October 20, 1999
... stability (e.g., moisture uptake and thermal stability) of Photo-BCB were also measured. The equilibrium moisture content at 84 percent RH in ambient temperature was low, 0.14 wt percent and the thermally induced weight loss at 330°C in helium atmosphere was less than 1 percent/h. The low moisture...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 55–60.
Published Online: August 31, 1999
... creates an obstacle to remove the coated substrates and to reuse the high cost pallets. However, one of the approaches to address this demand is introducing a low modulus elastic material combined with a unique thermal stabilizer, which will be thermally stable at 400°C for 1 h and thermally degradable...