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Keywords: thermal stress cracking
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
Published Online: June 23, 2011
... integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray imaging thermal fatigue life prediction crack propagation phase growth solder joints flip chip, nondestructive inspection x-ray...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
Published Online: September 30, 2010
... to be more effective than wire bonding. 29 11 2009 08 08 2010 30 09 2010 30 09 2010 cracks fracture mechanics insulated gate bipolar transistors lead bonding power bipolar transistors semiconductor device reliability temperature distribution thermal analysis thermal stress...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
... integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip chip ball grid array (BGA) with an elastic underfill were investigated. As material...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
Published Online: May 8, 2008
... 2007 08 05 2008 aluminium compounds gas lasers laser beam cutting laser beam machining thermal stress cracking aluminum nitride cutting laser thermal stress packaging material Aluminum nitride (AlN) is an effective electronic packaging material due to its excellent...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
Published Online: November 29, 2006
.... Furthermore, if the surface of the initiator cools faster than the center, cracking is more likely. 24 05 2006 29 11 2006 cooling finite element analysis glass seals (stoppers) thermal management (packaging) thermal stress cracking wires Airbags were responsible for saving...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
Published Online: June 3, 2005
..., 2004. Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
...) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal expansion glass transition thermal analysis finite element analysis The need of ultra-dense and high I/O for integrated circuit designs has driven the development...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
Published Online: October 6, 2004
... 01 Jan 2004 06 10 2004 thermoelasticity heat conduction thermal stress cracking integrated circuit reliability thermal stresses Fourier series integrated circuit packaging The chip-substrate structure is an important part of IC (integrated circuits) devices in which...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 268–275.
Published Online: July 28, 2004
... thermal management (packaging) soldering thermal stress cracking fracture delamination When a plastic encapsulant absorbs moisture, it expands and causes hygrostresses to be developed in plastic-encapsulated IC packages. This is because of moisture concentration gradients in the encapsulant...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
Published Online: July 8, 2004
... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon Flip chip bonding technology using anisotropic conductive films (ACFs) has been used for decades in the area LCD display applications. In recent, there has been growing interest in using...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
Published Online: June 8, 2004
... are obtained. 16 05 2004 08 06 2004 31 05 2004 integrated circuit packaging plastic packaging encapsulation soldering delamination fracture mechanics viscoelasticity elasticity thermal analysis thermal stress cracking When a plastic IC package is in a reflow soldering...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 531–538.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2002. Associate Editor: L. Ernst. 01 November 2002 15 12 2003 soldering flip-chip devices creep thermal stress cracking fatigue The removal of lead from electronic products necessitates the replacement...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 562–568.
Published Online: December 15, 2003
... devices thermal stress cracking finite element analysis failure analysis As new packaging technologies emerge, thermo-mechanical reliability aspects have to be optimized or compared to the traditional approaches. Accordingly, the ability of the computational design of reliable solder joints...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
Published Online: September 17, 2003
... 2002 17 09 2003 ball grid arrays thermal stress cracking soldering reliability surface mount technology finite element analysis Thermal fatigue has been one of the most serious problems for solder joint reliability in electronic packaging. Many researchers have studied...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 347–353.
Published Online: September 17, 2003
... Congress, New York, NY, November 11–16, 2001. Manuscript received at ASME Headquarters, Sept. 2002. Associate Editor: J. Lau. 11 November 2001 01 Sep 2002 17 09 2003 plastic packaging ball grid arrays thermal stress cracking soldering finite element analysis modelling...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking Thermal stresses and deformations are the major contributor to malfunctions of, and failures in, microelectronics and photonics systems. Various kinds of thermal stress and strain induced failures...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 120–125.
Published Online: March 14, 2003
... soldering finite element analysis ball grid arrays integrated circuit packaging thermal stress cracking modelling viscoplasticity With the increasing use of surface mount bonding technology in microelectronics industry, the reliability concerns for solder joints are increasing exponentially...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
Published Online: March 14, 2003
... moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis Plastic packaging is the most popular technique in electronic packaging because of its low costs and ease of manufacture. However...