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Keywords: thermal warpage
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Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031001.
Paper No: EP-23-1070
https://doi.org/10.1115/1.4064354
Published Online: January 8, 2024
... on the top and bottom of the specimen would cause significant errors as the TIM is relatively compliant, but not for stiff TIMs. This study also proposes a modified gauge method with a few related strain equations for those cases with compliant TIMs to effectively determine their thermal warpages and CTEs...
View Article titled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and <span class="search-highlight">Thermal</span> <span class="search-highlight">Warpages</span> of Flip-Chip Packages With a Cap Using Strain Gauges
Open the PDF for Simultaneous Characterization of Both Coefficients of Thermal Expansion and <span class="search-highlight">Thermal</span> <span class="search-highlight">Warpages</span> of Flip-Chip Packages With a Cap Using Strain Gauges in another window
Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping