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Keywords: thermosonic bonding
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031001.
Paper No: EP-12-1083
Published Online: May 5, 2014
... to lower the bonding strength. Thermosonic bonding can dramatically decrease the bonding temperature, and therefore, it is widely used in the microelectronics package industry [ 14 , 15 ]; furthermore, thermosonic bumping can potentially overcome the abovementioned problems. In fact, Lee et al. used...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding is a high yield, high speed automated...