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Keywords: transient analysis
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041003.
Published Online: December 8, 2011
... management task for the artillery application challenging. The ability to accurately analyze these designs requires the use of fully coupled thermal-stress transient-analysis with accurate material properties over the full temperature range. To highlight the thermal-stress transient effects, the potted...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
Published Online: June 6, 2006
... size, are proposed and examined numerically. The transient analysis follows the support excitation scheme and incorporates an implicit time integration solver. Numerical results indicate that the drop reliability of the package enhances as the die thickness as well as the die size decreases. Moreover...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 281–284.
Published Online: October 7, 2005
... packaging transient analysis thermal analysis ball grid arrays integrated circuit testing finite element analysis power cycling thermal cycling JEDEC transient thermal analysis The standards regulated by the Joint Electron Device Engineering Council (JEDEC) have been widely applied...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003; final revision, February 2004. Associate Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth...