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Keywords: underfilling process
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
Published Online: April 5, 2024
...Calvin Ling; Muhammad Taufik Azahari; Mohamad Aizat Abas; Fei Chong Ng This paper investigates voiding issues in the underfilling process of ball grid array (BGA) chip packages under various parameter settings such as chip conveyor speed, valve pressure, temperature, and dispense pattern complicate...
