... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 11, 2017; final manuscript received February 14, 2018; published online May 11, 2018. Assoc. Editor: Yi-Shao Lai. 11 12 2017 14 02 2018 3D packaging Wafer level packaging Wafer scale three-dimensional...

... SOC Wafer level packaging The United States Government retains, and by accepting the article for publication, the publisher acknowledges that the United States Government retains, a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this work...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

... September 29, 2014; final manuscript received July 14, 2016; published online August 10, 2016. Assoc. Editor: Toru Ikeda. 29 09 2014 14 07 2016 3D packaging Area array COB CSP FR-4 Wafer level packaging Mechanical failures of hand-held devices lose their effective...

..., 2016; published online July 25, 2016. Assoc. Editor: Eric Wong. 06 04 2016 22 06 2016 3D packaging High density interconnects Underfill Wafer level packaging In this paper, a flip chip is defined [ 1 – 4 ] as a chip attached to the pads of a substrate or another chip...

.... The most widely used methods are based on the standards set by Joint Electron Devices Engineering Council (JEDEC) [ 1 ]. Flip chip Wafer level packaging 30 06 2014 16 09 2015 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL...

...Jia Xi; Xinduo Zhai; Jun Wang; Donglun Yang; Mao Ru; Fei Xiao; Li Zhang; Chi Ming Lai FeNi alloy is considered a possible substitute for Cu as under bump metallization (UBM) in wafer level package (WLP) since it forms very thin intermetallic compound (IMC) layer with Pb-free solder in the reflow...

... back to the evaporator as shown in Fig. 1 [ 1 ]. 3D packaging Flexible circuits MEMS Microsystems Nanotechnolgy Thermal analysis Wafer level packaging 04 08 2014 10 10 2014 Contributed by the Electronic and Photonic Packaging Division of ASME for publication...

... ACKAGING . Manuscript received January 7, 2014; final manuscript received April 6, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie. 07 01 2014 06 04 2014 Fast development of wafer level packaging (WLP) in recent years is mainly owing to the advances in integrated...

... wafer level packaging 2010 American Society of Mechanical Engineers ...

... assembling chip scale packaging creep integrated circuit manufacture printed circuits solders Taguchi methods wafer level packaging temperature cyclic loading Taguchi method lead-free solder wafer level chip scale package (WLCSP) Owing to the mismatch of coefficient of thermal...

... and laser techniques for structuring the metallization layer have been applied to generate structures for reliable interconnects capable for the use of lead-free solders. Summarized, this paper presents the process development and feasibility analysis of wafer level packaging technologies for modular SiP...

...Y. T. Lin, Graduate Assistant; C. T. Peng, Graduate Assistant; K. N. Chiang, Associate Professor The demands for electronic packages with lower profile, lighter weight, and higher input/output (I/O) density have led to rapid expansion in flip chip, chip scale package (CSP) and wafer level packaging...