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Keywords: wire-bond failure
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
Published Online: June 17, 2019
... calculated by averaging the respective values for each cycle over the test duration up to the determined number of cycles to failure, i.e., to the first wire-bond failure. These test results are summarized in Table 3 for each of the ten test cases. The table includes all relevant control parameters...
