Recent emphasis of the Department of Defense (DOD) on the reliability and integrity of avionics has spurred a new wave of research on this subject. This paper presents the results of a parametric investigation conducted to study the effect of vibration direction, boundary conditions, stiffeners and/or point supports, lead type, lead height, and the layout of the components on the natural frequencies and stresses exerted on a typical printed circuit board (PCB) used in avionics. The “robust design” procedure was adopted using a series of computer-simulated experiments. A finite element software, EMRC-FEAP, was utilized to estimate the maximum von Mises stresses within the critical leads, while the statistical analysis system (SAS) software was employed to analyze the natural frequency responses of the system and the signal-to-noise ratio (SNR) of the stresses induced at critical leads.
Skip Nav Destination
Article navigation
September 1994
Research Papers
Designing Surface-Mounted Components for High Reliability
J. Rasty,
J. Rasty
Mechanical Engineering Department, Texas Tech University, Lubbock, TX 79409
Search for other works by this author on:
W. Kolarik,
W. Kolarik
Industrial Engineering Department, Texas Tech University, Lubbock, TX 79409
Search for other works by this author on:
B. Chen
B. Chen
Mechanical Engineering Department, Texas Tech University, Lubbock, TX 79409
Search for other works by this author on:
J. Rasty
Mechanical Engineering Department, Texas Tech University, Lubbock, TX 79409
W. Kolarik
Industrial Engineering Department, Texas Tech University, Lubbock, TX 79409
B. Chen
Mechanical Engineering Department, Texas Tech University, Lubbock, TX 79409
J. Energy Resour. Technol. Sep 1994, 116(3): 232-239 (8 pages)
Published Online: September 1, 1994
Article history
Received:
April 15, 1992
Revised:
August 25, 1992
Online:
April 16, 2008
Citation
Rasty, J., Kolarik, W., and Chen, B. (September 1, 1994). "Designing Surface-Mounted Components for High Reliability." ASME. J. Energy Resour. Technol. September 1994; 116(3): 232–239. https://doi.org/10.1115/1.2906448
Download citation file:
10
Views
Get Email Alerts
Cited By
Related Articles
A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices
Appl. Mech. Rev (March,2011)
Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
J. Electron. Packag (December,1996)
Effect of Vibrations on Thermal Performance of Miniature Loop Heat Pipe for Avionics Cooling: An Experimental Analysis
J. Heat Transfer (September,2019)
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
J. Electron. Packag (December,2007)
Related Proceedings Papers
Related Chapters
Managing Energy Resources from within the Corporate Information Technology System
Industrial Energy Systems
Orthogonal Polynomial and Treatment Quantification for Missing Data
Taguchi Methods: Benefits, Impacts, Mathematics, Statistics and Applications
Approximate Analysis of Plates
Design of Plate and Shell Structures