You do not currently have access to this content.
Skip Nav Destination
Article navigation
Technical Briefs
Natural Convection and Radiation Heat Transfer From an Array of Inclined Pin Fins
M. E. Alessio,
M. E. Alessio
Tactical Systems Department, General Electric Co., Pittsfield, MA 01201
Search for other works by this author on:
D. A. Kaminski
D. A. Kaminski
Department of Mechanical Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
Search for other works by this author on:
M. E. Alessio
Tactical Systems Department, General Electric Co., Pittsfield, MA 01201
D. A. Kaminski
Department of Mechanical Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
J. Heat Transfer. Feb 1989, 111(1): 197-199 (3 pages)
Published Online: February 1, 1989
Article history
Received:
October 26, 1987
Online:
October 20, 2009
Citation
Alessio, M. E., and Kaminski, D. A. (February 1, 1989). "Natural Convection and Radiation Heat Transfer From an Array of Inclined Pin Fins." ASME. J. Heat Transfer. February 1989; 111(1): 197–199. https://doi.org/10.1115/1.3250648
Download citation file:
Get Email Alerts
Cited By
Thermal Anisotropy and Heat Flux Deviation Degree of Composites
J. Heat Mass Transfer
Reviewer's Recognition
J. Heat Mass Transfer (April 2025)
Related Articles
Study and Optimization of Horizontal-Base Pin-Fin Heat Sinks in Natural Convection and Radiation
J. Heat Transfer (January,2010)
Scale-Up and Generalization of Horizontal-Base Pin-Fin Heat Sinks in Natural Convection and Radiation
J. Heat Transfer (November,2010)
Natural Convection in L Corners With Surface Radiation and Conduction
J. Heat Transfer (February,1996)
Related Proceedings Papers
Related Chapters
Cooling of Steel Spherical Balls by Natural Convection and Radiation Heat Transfer in Unsteady State
Electromagnetic Waves and Heat Transfer: Sensitivites to Governing Variables in Everyday Life
Applications
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow
Radiation
Thermal Management of Microelectronic Equipment