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Journal Articles

Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

Daniel Lorenzini, Wenming Li, Yogendra Joshi

J. Heat Mass Transfer. April 2023, 145(4): 041603.

Paper No: HT-22-1470

DOI: https://doi.org/10.1115/1.4056594

Published Online: February 3, 2023

View Article titled, Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

Topics: Boiling, Cooling, Flow (Dynamics), Fluids, Plasma desorption mass spectrometry, Vapors, Temperature, Computer simulation, Computational fluid dynamics, Heat

Journal Articles

Design and Evaluation of a MEMS-Based Stirling Microcooler

Dongzhi Guo, Jinsheng Gao, Alan J. H. McGaughey, Gary K. Fedder, Matthew Moran, Shi-Chune Yao

J. Heat Transfer. November 2013, 135(11): 111003.

Paper No: HT-12-1144

DOI: https://doi.org/10.1115/1.4024596

Published Online: September 23, 2013

View Article titled, Design and Evaluation of a MEMS-Based Stirling Microcooler

Topics: Cooling, Cycles, Design, Heat, Heat transfer, Microcoolers, Microelectromechanical systems, Porosity, Silicon, Temperature

Journal Articles

Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum

Taishan Zhu, Wenjing Ye

J. Heat Transfer. May 2012, 134(5): 051013.

DOI: https://doi.org/10.1115/1.4005704

Published Online: April 13, 2012

View Article titled, Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum

Topics: Flow (Dynamics), Heat, Heat conduction, Heat flux, Heat transfer, Microelectromechanical systems, Modeling, Plates (structures), Sensors, Simulation

Journal Articles

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 Torr to 625 Torr

Leslie M. Phinney, Justin R. Serrano, Edward S. Piekos, John R. Torczynski, Michael A. Gallis, Allen D. Gorby

J. Heat Transfer. July 2010, 132(7): 072402.

DOI: https://doi.org/10.1115/1.4000965

Published Online: April 28, 2010

View Article titled, Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 Torr to 625 Torr

Topics: Bridges (Structures), Finite element analysis, Heat transfer, Microelectromechanical systems, Pressure, Simulation, Temperature, Temperature measurement, Heat conduction, Temperature profiles

Journal Articles

Investigation Into the Similarity Solution for Boundary Layer Flows in Microsystems

Suhil Kiwan, M. A. Al-Nimr

J. Heat Transfer. April 2010, 132(4): 041011.

DOI: https://doi.org/10.1115/1.4000886

Published Online: February 22, 2010

View Article titled, Investigation Into the Similarity Solution for Boundary Layer Flows in Microsystems

Topics: Boundary layers, Flow (Dynamics), Heat transfer, Temperature, Fluids, Microelectromechanical systems, Stagnation flow

Journal Articles

A Micro-Insulation Concept for MEMS Applications

Rui Yao, James Blanchard

J. Heat Transfer. May 2009, 131(5): 052401.

DOI: https://doi.org/10.1115/1.3084121

Published Online: March 16, 2009

View Article titled, A Micro-Insulation Concept for MEMS Applications

Topics: Heat conduction, Insulation, Thermal conductivity, Heat, Microelectromechanical systems, Temperature, Pressure

Journal Articles

Time-Resolved Micro-Raman Thermometry for Microsystems in Motion

Justin R. Serrano, Sean P. Kearney

J. Heat Transfer. December 2008, 130(12): 122401.

DOI: https://doi.org/10.1115/1.2976552

Published Online: September 16, 2008

View Article titled, Time-Resolved Micro-Raman Thermometry for Microsystems in Motion

Topics: Actuators, Microelectromechanical systems, Temperature, Temperature measurement, Signals, Lasers, Probes

Journal Articles

Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the 3 ω Method

Ankur Jain, Kenneth E. Goodson

J. Heat Transfer. October 2008, 130(10): 102402.

DOI: https://doi.org/10.1115/1.2945904

Published Online: August 8, 2008

View Article titled, Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the 3 ω Method

Topics: Heat capacity, Microfabrication, Temperature, Thermal conductivity, Thin films, Nickel titanium alloys, Shape memory effects, Metals, Silicon nitride ceramics, Microelectromechanical systems

Journal Articles

Experimental Study on Fundamental Phenomena of Boiling Using Heat Transfer Surfaces With Well-Defined Cavities Created by MEMS (Effect of Spacing Between Cavities)

Takato Sato, Yasuo Koizumi, Hiroyasu Ohtake

J. Heat Transfer. August 2008, 130(8): 084501.

DOI: https://doi.org/10.1115/1.2927399

Published Online: May 29, 2008

View Article titled, Experimental Study on Fundamental Phenomena of Boiling Using Heat Transfer Surfaces With Well-Defined Cavities Created by MEMS (Effect of Spacing Between Cavities)

Topics: Boiling, Bubbles, Cavities, Heat transfer, Microelectromechanical systems, Nucleation (Physics), Temperature, Nucleate boiling

Journal Articles

Publisher's Note: “Phase-Change Heat Transfer in Microsystems” [ Journal of Heat Transfer, 2007, 129(2), pp. 101–107 ]

Ping Cheng, Hui-Ying Wu, Fang-Jun Hong

J. Heat Transfer. May 2007, 129(5): 683.

DOI: https://doi.org/10.1115/1.2740784

Published Online: May 1, 2007

View Article titled, Publisher's Note: “Phase-Change Heat Transfer in Microsystems” [ Journal of Heat Transfer, 2007, 129(2), pp. 101–107 ]

Topics: Heat transfer, Microelectromechanical systems

Journal Articles

Raman Thermometry of Polysilicon Microelectro-mechanical Systems in the Presence of an Evolving Stress

Mark R. Abel, Samuel Graham, Justin R. Serrano, Sean P. Kearney, Leslie M. Phinney

J. Heat Transfer. March 2007, 129(3): 329–334.

DOI: https://doi.org/10.1115/1.2409996

Published Online: May 31, 2006

View Article titled, Raman Thermometry of Polysilicon Microelectro-mechanical Systems in the Presence of an Evolving Stress

Topics: Calibration, Polysilicon, Spectral linewidth, Stress, Temperature, Temperature measurement, Uncertainty, Thermal stresses, Raman spectroscopy, Microelectromechanical systems

Journal Articles

Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead

I. Hassan

J. Heat Transfer. November 2006, 128(11): 1221–1233.

DOI: https://doi.org/10.1115/1.2352792

Published Online: March 30, 2006

View Article titled, Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead

Topics: Flow (Dynamics), Fluids, Heat transfer, Microchannels, Microelectromechanical systems, Micropumps, Microsensors, Temperature, Heat flux, Design

Journal Articles

Thermal-Hydraulic Performance of MEMS-based Pin Fin Heat Sink

Ali Koşar, Yoav Peles

J. Heat Transfer. February 2006, 128(2): 121–131.

DOI: https://doi.org/10.1115/1.2137760

Published Online: August 8, 2005

View Article titled, Thermal-Hydraulic Performance of MEMS-based Pin Fin Heat Sink

Topics: Fins, Flow (Dynamics), Friction, Heat sinks, Heat transfer, Heat transfer coefficients, Microelectromechanical systems, Pressure drop, Reynolds number, Thermal resistance

Journal Articles

Coupled Field Analyses in MEMS With Finite Element Analysis

Ravi Chandra Sikakollu, Lemmy Meekisho, Andres LaRosa

J. Heat Transfer. January 2005, 127(1): 34–37.

DOI: https://doi.org/10.1115/1.1804204

Published Online: February 15, 2005

View Article titled, Coupled Field Analyses in MEMS With Finite Element Analysis

Topics: Actuators, Boundary-value problems, Finite element analysis, Microelectromechanical systems, Dimensions, Thermal stresses, Temperature

Journal Articles

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

Cristina H. Amon, S.-C. Yao, C.-F. Wu, C.-C. Hsieh

J. Heat Transfer. January 2005, 127(1): 66–75.

DOI: https://doi.org/10.1115/1.1839586

Published Online: February 15, 2005

View Article titled, Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

Topics: Coolants, Cooling, Drops, Electronics, Engineering prototypes, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Heat transfer

Journal Articles

A MEMS Piston-Cylinder Device Actuated by Combustion

Dae Hoon Lee, Dae-Eun Park, Euisik Yoon, Sejin Kwon

J. Heat Transfer. June 2003, 125(3): 487–493.

DOI: https://doi.org/10.1115/1.1565095

Published Online: May 20, 2003

View Article titled, A MEMS Piston-Cylinder Device Actuated by Combustion

Topics: Combustion, Combustion chambers, Microelectromechanical systems, Heat losses, Cylinders, Pressure, Design, Manufacturing, Quenching (Metalworking), Heat transfer

Journal Articles

Nanosecond Laser Repair of Adhered MEMS Structures

James W. Rogers, Leslie M. Phinney

J. Heat Transfer. April 2002, 124(2): 394–396.

DOI: https://doi.org/10.1115/1.1447936

Published Online: August 6, 2001

View Article titled, Nanosecond Laser Repair of Adhered MEMS Structures

Topics: Adhesion, Lasers, Maintenance, Stiction, Fluence (Radiation measurement), Microcantilevers, Microelectromechanical systems, Nd-YAG lasers

Journal Articles

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong

J. Heat Transfer. February 1998, 120(1): 30–36.

DOI: https://doi.org/10.1115/1.2830059

Published Online: February 1, 1998

View Article titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

Topics: Crystals, Heat conduction, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Phonons, Semiconductor wafers, Transistors, Cantilevers

Journal citation

NARROW

Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

Design and Evaluation of a MEMS-Based Stirling Microcooler

Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 Torr to 625 Torr

Investigation Into the Similarity Solution for Boundary Layer Flows in Microsystems

A Micro-Insulation Concept for MEMS Applications

Time-Resolved Micro-Raman Thermometry for Microsystems in Motion

Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the 3 ω Method

Experimental Study on Fundamental Phenomena of Boiling Using Heat Transfer Surfaces With Well-Defined Cavities Created by MEMS (Effect of Spacing Between Cavities)

Publisher's Note: “Phase-Change Heat Transfer in Microsystems” [ Journal of Heat Transfer, 2007, 129(2), pp. 101–107 ]

Raman Thermometry of Polysilicon Microelectro-mechanical Systems in the Presence of an Evolving Stress

Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead

Thermal-Hydraulic Performance of MEMS-based Pin Fin Heat Sink

Coupled Field Analyses in MEMS With Finite Element Analysis

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

A MEMS Piston-Cylinder Device Actuated by Combustion

Nanosecond Laser Repair of Adhered MEMS Structures

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

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