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Keywords: 3D chip stack
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2010, 132(12): 121402.
Published Online: September 22, 2010
... / m K . Comparison of equilibrium and nonequilibrium model at benchmark operating chip In conclusion, we have developed a nonequilibrium porous medium based model to predict high local thermal gradients in vertically integrated (3D) chip stacks. The cooling cavities...
