1-20 of 21
Keywords: Electronics
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. July 2007, 129(7): 790–797.
Published Online: September 19, 2006
...-Length and Time Scale Thermal Transport Using the Lattice Boltzmann Method with Application to Electronics Cooling ,” Int. J. Heat Mass Transfer 0017-9310 10.1016/j.ijheatmasstransfer.2005.08.003 , 49 , pp. 97 – 107 . Bai , P. C. , et al. , 2004 , “ A 65nm Logic Technology Featuring...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. January 2006, 128(1): 93–99.
Published Online: February 10, 2005
.... , and Slocum , A. H. , 2005 , “ A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing ” (unpublished). Sweetland , M. , 2001 , Design of Thermal Control Systems for Testing of Electronics , PhD thesis, Massachusetts Institute of Technology, Cambridge...
Topics: Temperature
Journal Articles
Article Type: Research Papers
J. Heat Transfer. July 2005, 127(7): 675–683.
Published Online: February 2, 2005
..., the exponent n decreases as well, similar to the findings of Nakayama et al. ( 13 ). 04 05 2004 02 02 2005 dielectric liquids boiling two-phase flow heat transfer channel flow curve fitting Boiling Electronics Enhancement Experimental Heat Transfer Microstructures...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. December 2004, 126(6): 946–955.
Published Online: January 26, 2005
... , A. A. , and Majumdar , A. , 1993 , “ Transient Ballistic and Diffusive Phonon Transport in Thin Films ,” J. Appl. Phys. , 74 ( 1 ), pp. 31 – 39 . Goodson , K. E. , 1996 , “ Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures ,” ASME J. Heat Transfer , 118 , pp. 279...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. June 2004, 126(3): 347–354.
Published Online: June 16, 2004
... vapour pressure flow simulation porosity equations of state Electronics Heat Pipes Phase Change Three-Dimensional Transient Heat pipes are widely used in electronics cooling applications, both as efficient heat spreaders and to transport heat to remote heat sinks for dissipation...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. December 2003, 125(6): 999–1006.
Published Online: November 19, 2003
... September 2002 03 July 2003 19 11 2003 hydrodynamics heat transfer Channel Flow Conjugate Electronics Heat Transfer Heat Exchangers Shrouded pin fin arrays such as those shown at the top of Fig. 1 are a common geometry employed to enhance forced convection heat...
Journal Articles
Article Type: Technical Notes
J. Heat Transfer. August 2003, 125(4): 734–739.
Published Online: July 17, 2003
...G. Desrayaud; A. Fichera This paper presents the numerical predictions of heat transfer and fluid flow characteristics for natural convection in a vertical channel with two-dimensional protruding heat-flux module as applied to the cooling of electronic components. The investigation...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. August 2003, 125(4): 575–586.
Published Online: July 17, 2003
... by the Heat Transfer Division July 15, 2002; revision received February 14, 2003. Associate Editor: S. P. Vanka. 15 July 2002 14 February 2003 17 07 2003 jets cooling heat transfer temperature distribution flow simulation Navier-Stokes equations Convection Electronics...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. February 2003, 125(1): 156–163.
Published Online: January 29, 2003
... December 17, 2001; revision received July 3, 2002. Associate Editor: D. Poulikakos. 17 December 2001 03 July 2002 29 01 2003 infrared imaging finite element analysis liquid films Electronics Heat Transfer Microscale Microstructures Nanoscale Nonintrusive Diagnostics...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. February 2003, 125(1): 103–109.
Published Online: January 29, 2003
.... The averaged values were used to calculate the temperature gradient and the heat input to the enhanced structure. The tests were continued until the temperature at the base of the enhanced structure exceeded 85°C, a limit for most commercial electronics. Finally, the heat input was decremented through the same...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. February 2003, 125(1): 164–174.
Published Online: January 29, 2003
... 01 2003 thermal variables control temperature control distributed parameter systems integrated circuit design integrated circuit packaging Conduction Control Electronics Heat Transfer Temperature All high-performance electronic devices are subject to a 100 percent...
Topics: Temperature
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. December 2002, 124(6): 1009–1018.
Published Online: December 3, 2002
... thermal conductivity thermoreflectance Computational Electronics Experimental Heat Transfer Thin Films The performance of electronic and telecommunication devices depends heavily on electro-thermal interactions, making the knowledge of material properties fundamental to the design...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2002, 124(5): 954–962.
Published Online: September 11, 2002
...T. S. Fisher; D. G. Walker This paper considers the theory of electron field emission from nanoscale emitters with particular focus on thermal and electrical energy transport. The foundational theory of field emission is explored, and a model is presented that accounts explicitly for the energy...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2002, 124(5): 881–890.
Published Online: September 11, 2002
...S. I. Haider; Yogendra K. Joshi; Wataru Nakayama This study presents a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. The focus is on CLTPTs for electronics cooling that exhibit complex two-phase flow...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. February 2001, 123(1): 130–137.
Published Online: June 25, 2000
... larger than a prediction using the heat diffusion equation for the entire domain. The disparity results both from phonon-boundary scattering and from the small dimensions of the region of strongest electron-phonon energy transfer. This work clearly shows the importance of sub-continuum heat conduction...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 1999, 121(1): 6–14.
Published Online: February 1, 1999
... and point to that it can be optimized geometrically. The path can be arranged optimally in space. The geometric optimization of assemljlies of heat-generating components is also an essential feature of many of the more recent contributions to the cooling of electronics (e.g., Bar- Cohen and Rohsenow, 1984...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 1999, 121(1): 34–42.
Published Online: February 1, 1999
... electronic components. Comparisons of the obstacle mean Nusselt numbers are made with a two-dimensional laminar numerical model employing the Navier-Stokes equations. A set of correlations characterizing the heat transfer from the protruding heat sources within the channel is obtained. It was found...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1998, 120(4): 830–839.
Published Online: November 1, 1998
... and greases have also been implemented. This review article covers recent developments in heat sink designs and applications intended for high-end high-power dissipation systems. A review of recent studies of card effects in the thermal enhancement of electronic packages is also presented. In certain...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1998, 120(4): 977–984.
Published Online: November 1, 1998
..., vascularized tissues, lightning, neural dendrites, dendritic crystals). The optimal volume-to-point heat flow is of fundamental interest in the geometric optimization of cooling schemes for small-scale electronic components. The state of the art in this Contributed by the Heat Transfer Division for publication...
Topics: Heat conduction
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1998, 120(3): 633–640.
Published Online: August 1, 1998
... 1998 05 12 2007 Electronics Finned Surfaces Heat Transfer Natural Convection Optimization Aihara T. , Maruyama S. , and Kobayakawa S. , 1990 , “ Free Convective/Radiative Heat Transfer from Pin-Fin Arrays with a Vertical Base Plate (general representation of heat...