... 2023 artificial bee colony algorithm electronic cooling multi-objective optimization multiple PCMs melting and solidification Thermal management of electronics has emerged as a critical field of study, with continuous performance improvements (technological node) accompanied...

... heat transfer coefficient electronic cooling The development of efficient heat exchangers is imperative in addressing the challenge of increased levels of heat flux dissipation in high-performance miniature electronic devices. High-porosity metal foams (MFs) have emerged as highly efficient...

... for a variety of applications including electronics cooling. In this work, advanced heat management devices are designed and numerically studied employing single and multijet impingement through porous-filled channels with inclined walls. The base of these porous-filled nonuniform heat exchanging channels...

... heat sinks Fig. 12 Temperature distribution at the cross section in the middle of the channel inlet and outlet Electronic cooling Heat and mass transfer Heat exchangers Heat transfer enhancement Micro heat transfer Nanoscale heat transfer As the semiconductor industry...

... of ASME for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received August 2, 2017; final manuscript received June 28, 2018; published online August 3, 2018. Assoc. Editor: Debjyoti Banerjee. 02 08 2017 28 06 2018 Electronic cooling Energy systems Melting Melting...

... OURNAL OF H EAT T RANSFER . Manuscript received September 8, 2017; final manuscript received May 31, 2018; published online July 23, 2018. Assoc. Editor: Danesh K. Tafti. 08 09 2017 31 05 2018 Computational fluid dynamics Electronic cooling Experimental techniques Heat and mass...

... Transfer Division of ASME for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received June 10, 2017; final manuscript received March 28, 2018; published online July 23, 2018. Assoc. Editor: Thomas Beechem. 10 06 2017 28 03 2018 Electronic cooling Evaporation Heat...

... No.: NPRP 6-1304-2-525. *Corresponding author: jorge.alvarado@tamu.edu Experimental Angled View S = 0.65 mm S = 1.2 mm S = 2 mm Numerical Side View Experimental Side View 1 Corresponding author. 27 04 2018 09 05 2018 Bubbles Computational fluid dynamics Electronic cooling...

... received November 13, 2017; published online June 29, 2018. Assoc. Editor: Zhixiong Guo. 08 05 2017 13 11 2017 Computational fluid dynamics Conduction Electronic cooling Energy systems Heat exchangers Heat transfer enhancement Natural convection Porous media Thermal systems...

... January 23, 2018; final manuscript received April 19, 2018; published online June 8, 2018. Assoc. Editor: George S. Dulikravich. 23 01 2018 19 04 2018 Conduction Electronic cooling Thermophysical properties An integrated circuit's junction (or channel) temperature is a key...

... in the J OURNAL OF H EAT T RANSFER . Manuscript received October 2, 2016; final manuscript received April 26, 2018; published online June 7, 2018. Assoc. Editor: Antonio Barletta. 02 10 2016 26 04 2018 Electronic cooling Extended surfaces Natural convection Thermal systems Mixed...

... is applied with a kinetic energy intensity of 10% and eddy length of 0.5 cm. 10% turbulent kinetic energy is similar to what is produced by fans typically used for forced convection electronics cooling applications. Due to symmetry, it is sufficient to consider half the heat-sink in the simulation domain...

... for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received April 19, 2017; final manuscript received April 21, 2018; published online May 25, 2018. Assoc. Editor: Thomas Beechem. 19 04 2017 21 04 2018 Aerospace Electronic cooling Extended surfaces Heat exchangers Heat...

... and fluid flow inside the enclosure. But in several real life applications, the flow geometry is complicated with embedded solid bodies or fins or partial baffles. The coupled surface radiation and natural convection in such complex enclosures have been reported by few authors [ 5 – 8 ]. Electronic...

... OF H EAT T RANSFER . Manuscript received April 24, 2017; final manuscript received October 29, 2017; published online April 6, 2018. Assoc. Editor: Alan McGaughey. 24 04 2017 29 10 2017 Conduction Electronic cooling Thermal management is considered as a key factor...

.... Contributed by the Heat Transfer Division of ASME for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received October 31, 2016; final manuscript received January 6, 2018; published online March 30, 2018. Assoc. Editor: Antonio Barletta. 31 10 2016 06 01 2018 Electronic...

... ] as per Fig. 1 that depicts a structured microchannel etched into the upper portion of a microprocessor die. Computational fluid dynamics Electronic cooling Forced convection Heat transfer enhancement Micro heat transfer Nanoscale heat transfer 05 07 2017 18 01 2018...

..., 2017; final manuscript received October 16, 2017; published online January 30, 2018. Assoc. Editor: Ali Khounsary. 30 05 2017 16 10 2017 Electronic cooling Heat exchangers Micro heat transfer Nanoscale heat transfer Flow networks are characterized by a plurality...

..., the flow gets higher resistance from the cylinder inner walls so the flow passing through the cylinder falls with the increase in L / D at a particular Ra. Fig. 10 Thermal plume around a vertical hollow cylinder for various L / D at Ra = 10 7 Electronic cooling Natural convection...

... in the J OURNAL OF H EAT T RANSFER . Manuscript received February 22, 2017; final manuscript received July 10, 2017; published online October 10, 2017. Assoc. Editor: Danesh K. Tafti. 22 02 2017 10 07 2017 Electronic cooling Forced convection Heat and mass transfer Heat transfer...