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Keywords: semiconductor device models
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Journal Articles

Characterization and Modeling of the Heat Transfer Performance of Nanostructured Cu Micropost Wicks

Youngsuk Nam, Stephen Sharratt, Gilhwan Cha, Y. Sungtaek Ju
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2011, 133(10): 101502.
https://doi.org/10.1115/1.4004168
Published Online: August 11, 2011
... nanostructured materials oxidation power semiconductor devices semiconductor device models thermal management (packaging) 08 07 2010 02 05 2011 11 08 2011 11 08 2011 We report the heat transfer performance of microfabricated Cu post wicks. CuO nanostructures integrated onto...
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Topics: Copper, Heat, Heat pipes, Heat transfer, Heat transfer coefficients, Modeling, Oxidation, Shapes, Temperature, Semiconductor devices
Journal Articles

Influence of Phonon Dispersion on Transient Thermal Response of Silicon-on-Insulator Transistors Under Self-Heating Conditions

Rodrigo A. Escobar, Cristina H. Amon
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. July 2007, 129(7): 790–797.
https://doi.org/10.1115/1.2717243
Published Online: September 19, 2006
... are found to be higher than those from Fourier diffusion predictions, displaying a nonlinear relation to hotspot size, for a given, fixed, domain size. 22 12 2005 19 09 2006 silicon-on-insulator MOSFET phonon dispersion relations lattice Boltzmann methods semiconductor device models...
View Article titled, Influence of Phonon Dispersion on Transient Thermal Response of Silicon-on-Insulator Transistors Under Self-Heating Conditions
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Topics: Diffusion (Physics), Heat, Phonons, Silicon-on-insulator, Temperature, Transistors, Heating, Simulation, Transients (Dynamics), Modeling