... 2012 13 02 2012 heat transfer phase change materials pipe flow thermal management (packaging) two-phase flow micro-encapsulated phase change material thermal boundary layer enhancement of heat transfer A phase change material (PCM) is a substance with a high latent heat...

... of Finned Arrays,” ASME J. Heat Transfer , 107 , p. 746 . 10.1115/1.3247499 22 11 2010 28 06 2011 20 01 2012 20 01 2012 cooling heat exchangers plates (structures) thermal management (packaging) equivalent fin height heat flow choke forced cooled electronic...

... nanostructured materials oxidation power semiconductor devices semiconductor device models thermal management (packaging) 08 07 2010 02 05 2011 11 08 2011 11 08 2011 We report the heat transfer performance of microfabricated Cu post wicks. CuO nanostructures integrated onto...

... management (packaging) pool boiling heat transfer enhancement microchannels grooves bubble dynamics During pool boiling, the latent heat involved with the phase change from liquid to vapor becomes significant in the heat removal process. The substantial increase in the heat transfer...

..., volume, and cost of the air-cooled electronics, the present V-shaped corrugated carbon foam emerges as an alternative heat sink. 10 05 2010 14 11 2010 02 02 2011 02 02 2011 carbon foams forced convection heat sinks thermal management (packaging) carbon foam thermal...

... porous media heat transfer microfluidics nanoporous materials thermal management (packaging) pool boiling enhancement copper nanodendrites electrochemical deposition electronics cooling dielectric liquids The ever increasing transistor density and processing speed of computer chips...

.... Application of proper orthogonal decomposition has been suggested by various authors ( 6 7 8 9 10 11 ) for the purpose of model reduction for complex electronic systems. computational fluid dynamics finite volume methods Galerkin method heat transfer matrix decomposition thermal management...

.../j.ijheatmasstransfer.2007.01.052 19 06 2009 23 09 2009 09 03 2010 09 03 2010 annealing capillarity carbon nanotubes cooling micromechanical devices temperature measurement thermal management (packaging) thermometers thermometer carbon nanotube wick structure...

... integrated circuit interconnections integrated circuit packaging microchannel flow microprocessor chips refrigerants thermal management (packaging) two-phase flow 02 02 2009 25 09 2009 19 02 2010 19 02 2010 2010 American Society of Mechanical Engineers ...

... sinks heat transfer laminar flow microchannel flow thermal management (packaging) 30 09 2008 11 04 2009 18 02 2010 18 02 2010 2010 American Society of Mechanical Engineers ...

... be considered for a large thermal mass system in order to achieve steady thermal control. The system presented is capable of maintaining steady thermal control within the given constraints. cooling heat conduction PD control Peltier effect temperature control thermal management (packaging...

... and heat sinks thermal management aerodynamics cooling fans heat conduction heat sinks thermal management (packaging) turbulence Scaling of the Nusselt number and Reynolds number for a range of rotor diameters and speeds Figure 12 demonstrates that the power of 0.8 collapses...

... copper elemental semiconductors evaporation heat pipes microprocessor chips porosity silicon statistical analysis thermal management (packaging) thermal resistance heat pipe vapor chamber nonuniform heating evaporative thermal performance silicon die heater As integrated...

... thermal management (packaging) thermal resistance carbon nanotube thermal interface material contact thermal resistance plasma CVD low temperature photoacoustic As semiconductor technology continues to advance, resulting in progressive reductions of device feature sizes and expansion...

... at an optimum location in either impingement or cross flow position, it can provide similar enhancements. 19 12 2006 25 06 2007 23 04 2008 cooling heat transfer jets microfluidics thermal management (packaging) synthetic jets electronics cooling thermal management impingement...

... were fiber-structure dependent. carbon fibres graphite nanostructured materials phase change materials thermal management (packaging) paraffin graphite nanofiber phase change material (PCM) thermal management Phase change materials (PCMs) are materials that undergo a phase...

... energy conservation and potential economic savings. exergy second-law analysis data center thermal management electronics cooling energy efficiency air conditioning cooling thermal management (packaging) total energy systems 2008 American Society of Mechanical Engineers ...

... sinks are provided. 11 04 2006 23 02 2007 cooling heat sinks heat transfer integrated circuit packaging thermal management (packaging) conjugate heat transfer thermal management microelectronics micro-fabrication microchannel liquid cooling Heat removal has...

... management (packaging) flat evaporator novel design electronic cooling miniature loop heat pipe mLHP thermal control Compact electronic devices such as notebooks with high performance microprocessors have been developed to meet the extensive data and graphic processing requirements...

... applications. spray cooling thermal management fins heat sink evaporation cooling thermal management (packaging) heat sinks microchannel flow sprays nozzles 21 07 2006 18 01 2007 2007 American Society of Mechanical Engineers ...