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Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T08A003, September 3, 2020
Paper No: LEMP2020-8524
.... Obtained interposer vias, which were silver region, were 8.2 μm diameter and 3.3 μm height, or 20.3 μm diameter and 5.3 μm height for 10 mm square size. silver ink LTIL UV-NIL Fabrication of flexible interposer using printing method Atsuhiro Furuta1, Kazuki Honjo1, Jun Taniguchi1 1 Tokyo...