Skip Nav Destination
1-1 of 1
Keywords: Raman imagingClose
Teppei Onuki, Shunsuke Kan, Wangpiao Lin, Wentong Lu, Kousuke Hasegawa, Hirotaka Ojima, Jun Shimizu, Libo Zhou
Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A002, September 3, 2020
Paper No: LEMP2020-8514
...-plane from the bottom end of the m-plane fracture to 14 microns- depth, subsequently induced elastic strain field around the fractures, could be visualized without destructions of the wafers. Keywords: Grinding damage, Sapphire, Raman imaging. 1. INTRODUCTION In manufacturing process of the...