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Keywords: Raman imaging
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Proceedings Papers

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A002, September 3, 2020
Paper No: LEMP2020-8514
...-plane from the bottom end of the m-plane fracture to 14 microns- depth, subsequently induced elastic strain field around the fractures, could be visualized without destructions of the wafers. Keywords: Grinding damage, Sapphire, Raman imaging. 1. INTRODUCTION In manufacturing process of the...