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Teppei Onuki, Shunsuke Kan, Wangpiao Lin, Wentong Lu, Kousuke Hasegawa, Hirotaka Ojima, Jun Shimizu, Libo Zhou
Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A002, September 3, 2020
Paper No: LEMP2020-8514
..., Japan ABSTRACT The objective of this study is to propose and develop an evaluation method on the process damages of sapphire wafers, regarding crystallographic aspects of the damages by use of tomographic imaging techniques with laser Raman microscopy (called as micro Raman tomographic imaging: mRTI...
Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T08A012, September 3, 2020
Paper No: LEMP2020-8577
... suppress of cracks growth by increase of hydrostatic pressure. Keywords: Ductile mode cutting, nano/micro cutting, hard/brittle material, soda glass, sapphire, critical depth of cut, specific cutting force. 1. INTRODUCTION Hard/brittle materials such as soda glass, quartz glass, sapphire, and silicon have...