In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.
Issue Section:Technical Brief
Keywords:diamond, copper, friction, adhesion, scanning electron microscopy, composite materials, high-temperature effects, high-temperature techniques, coating techniques, melting point, surface diffusion
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