Single crystal aluminum and copper of (001) and (110) orientation were shock peened using laser beam of 12 micron diameter and observed with X-ray micro-diffraction techniques based on a synchrotron light source. The X-ray micro-diffraction affords micron level resolution as compared with conventional X-ray diffraction which has only mm level resolution. The asymmetric and broadened diffraction profiles registered at each location were analyzed by sub-profiling and explained in terms of the heterogeneous dislocation cell structure. For the first time, the spatial distribution of residual stress induced in micro-scale laser shock peening was experimentally quantified and compared with the simulation result obtained from FEM analysis. Difference in material response and microstructure evolution under shock peening were explained in terms of material property difference in stack fault energy and its relationship with cross slip under plastic deformation. Difference in response caused by different orientations (110 and 001) and active slip systems was also investigated.
Spatially Resolved Characterization of Residual Stress Induced by Micro Scale Laser Shock Peening
Contributed by the Manufacturing Engineering Division for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received July 2003; Revised October 2003. Associate Editor: A. Shih.
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Chen , H., Yao , Y. L., and Kysar, J. W. (July 8, 2004). "Spatially Resolved Characterization of Residual Stress Induced by Micro Scale Laser Shock Peening ." ASME. J. Manuf. Sci. Eng. May 2004; 126(2): 226–236. https://doi.org/10.1115/1.1751189
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