Nickel and nickel-alloy microparts sized on the order of 5–1000 microns have been imaged in three dimensions using a new microscopic technique, Digital Volumetric Imaging (DVI). The gears were fabricated using Sandia National Laboratories’ LIGA technology (lithography, molding, and electroplating). The images were taken on a microscope built by Resolution Sciences Corporation by slicing the gear into one-micron thin slices, photographing each slice, and then reconstructing the image with software. The images were matched to the original CAD (computer aided design) model, allowing LIGA designers, for the first time, to see visually how much deviation from the design is induced by the manufacturing process. Calibration was done by imaging brass ball bearings and matching them to the CAD model of a sphere. A major advantage of DVI over scanning techniques is that internal defects can be imaged to very high resolution. In order to perform the metrology operations on the microcomponents, high-speed and high-precision algorithms are developed for coordinate metrology. The algorithms are based on a least-squares approach to data registration the point clouds generated from the component surface onto a target geometry defined in a CAD model. Both primitive geometric element analyses as well as an overall comparison of the part geometry are discussed. Initial results of the micromeasurements are presented in the paper.
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November 2004
Technical Papers
Three Dimensional Imaging of LIGA-Made Microcomponents
Douglas Chinn,
e-mail: dachinn@sandia.gov
Douglas Chinn
Sandia National Laboratories, P.O. Box 5800, MS0603 Albuquerque, NM 87185
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Peter Ostendorp,
Peter Ostendorp
Dartmouth College, HB 8000, Hanover, NH 03755
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Mike Haugh,
Mike Haugh
Resolution Sciences Corporation, 685 Northern Ave., Mill Valley, CA 94941
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Russell Kershmann,
Russell Kershmann
Resolution Sciences Corporation, 685 Northern Ave., Mill Valley, CA 94941
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Thomas Kurfess,
Thomas Kurfess
Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, GA 30332
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Andre Claudet,
Andre Claudet
Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, GA 30332
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Thomas Tucker
Thomas Tucker
Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, GA 30332
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Douglas Chinn
Sandia National Laboratories, P.O. Box 5800, MS0603 Albuquerque, NM 87185
e-mail: dachinn@sandia.gov
Peter Ostendorp
Dartmouth College, HB 8000, Hanover, NH 03755
Mike Haugh
Resolution Sciences Corporation, 685 Northern Ave., Mill Valley, CA 94941
Russell Kershmann
Resolution Sciences Corporation, 685 Northern Ave., Mill Valley, CA 94941
Thomas Kurfess
Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, GA 30332
Andre Claudet
Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, GA 30332
Thomas Tucker
Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, GA 30332
Contributed by the Manufacturing Engineering Division for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received February 9, 2004; revised September 1, 2004. Associate Editor: J. Ni.
J. Manuf. Sci. Eng. Nov 2004, 126(4): 813-821 (9 pages)
Published Online: February 4, 2005
Article history
Received:
February 9, 2004
Revised:
September 1, 2004
Online:
February 4, 2005
Citation
Chinn, D., Ostendorp, P., Haugh , M., Kershmann , R., Kurfess , T., Claudet , A., and Tucker , T. (February 4, 2005). "Three Dimensional Imaging of LIGA-Made Microcomponents ." ASME. J. Manuf. Sci. Eng. November 2004; 126(4): 813–821. https://doi.org/10.1115/1.1812774
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