During development of a spherical glass pressure hull made up of two hemispheres joined with a metallic joint ring, a problem of bearing edge cracking was encountered. A joint was developed through a series of model tests which placed the bearing edge in radial compression, thus eliminating the cracking. This joint was used to assemble a 56-in. spherical glass pressure hull which was proof-tested to 1610 psi (3650 ft) and cycled 100 times at 1000 psi (2250 ft). Three minor spalls occurred on the proof cycle. This spalling is attributed to either adhesion of the epoxy support material to the glass or support of surface irregularities by the epoxy. Testing was stopped at 100 cycles due to a failure in the epoxy seat-containing material. The joint concept appears workable to 4000 psi if the proper materials are used for the seat-containing material.
Skip Nav Destination
Article navigation
August 1970
This article was originally published in
Journal of Engineering for Industry
Research Papers
Development and Testing of a 56-In-Dia Jointed Glass Pressure Hull
D. W. Murphy
D. W. Murphy
Vehicle Systems Branch, Naval Undersea Warfare Center, Hawaii Division, Kailua, Hawaii
Search for other works by this author on:
D. W. Murphy
Vehicle Systems Branch, Naval Undersea Warfare Center, Hawaii Division, Kailua, Hawaii
J. Eng. Ind. Aug 1970, 92(3): 517-522
Published Online: August 1, 1970
Article history
Received:
June 12, 1969
Online:
July 15, 2010
Article
Article discussed|
View article
Connected Content
Citation
Murphy, D. W. (August 1, 1970). "Development and Testing of a 56-In-Dia Jointed Glass Pressure Hull." ASME. J. Eng. Ind. August 1970; 92(3): 517–522. https://doi.org/10.1115/1.3427795
Download citation file:
11
Views
Get Email Alerts
Cited By
Related Articles
The Influence of Thermoplastic Film Interleaving on the Interlaminar Shear Strength and Mode I Fracture of Laminated Composites
J. Eng. Mater. Technol (July,1996)
Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
J. Electron. Packag (June,1994)
Adhesion and Reliability of Epoxy/Glass Interfaces
J. Electron. Packag (December,2001)
Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages
J. Electron. Packag (September,1993)
Related Proceedings Papers
Related Chapters
Understanding the Problem
Design and Application of the Worm Gear
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
The ‘Regenerator Problem’
Air Engines: The History, Science, and Reality of the Perfect Engine