1-17 of 17
Keywords: copper
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2013, 135(6): 061011.
Paper No: MANU-13-1103
Published Online: November 18, 2013
... with moderate computational cost. The procedure is verified and used to simulate selected specific cases involving multiple sheets and dissimilar materials, i.e., copper and aluminum. The simulation procedure demonstrates its capability to predict welding energy, distortion, and temperature distribution...
Journal Articles
Article Type: Technical Briefs
J. Manuf. Sci. Eng. December 2011, 133(6): 064502.
Published Online: December 21, 2011
... moulding copper dislocation motion extrusion plastic flow stress-strain relations Size effects, i.e., increased data scatter, variations in material response, shape anomalies, etc., which occur with miniaturization as the grain size approaches the feature size, pose concerns when forming...
Journal Articles
Article Type: Research Papers
J. Manuf. Sci. Eng. December 2010, 132(6): 061009.
Published Online: November 10, 2010
... the effects of elevated temperature on deformation behavior of metallic materials during shock induced high strain rate deformation. In this study, LSP of copper are selected to systematically study the effects of elevated temperature in shock induced high strain rate deformation. Finite element modeling (FEM...
Journal Articles
Article Type: Special Issue On Nanomanufacturing
J. Manuf. Sci. Eng. June 2010, 132(3): 030908.
Published Online: May 26, 2010
... history of the machined surface, enabling microstructural engineering of surfaces. Application of the machining-based SPD to obtain deformation-microstructure maps is illustrated for a model material system—99.999% pure copper. Seemingly diverse, these unusual applications of machining are united...
Journal Articles
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2010, 132(2): 021004.
Published Online: March 30, 2010
... density on annealed pure copper during the EAF process. The flow stress reduction effect of the process was shown to decrease with increasing grain sizes. A threshold current density, required to achieve a significant reduction in the flow stresses, becomes more apparent at larger grain sizes...
Journal Articles
Article Type: Research Papers
J. Manuf. Sci. Eng. August 2009, 131(4): 041018.
Published Online: July 16, 2009
...), their best mechanical performances are close to those of solution treated compact AISI304 when Cu content is 3 wt % . 30 10 2008 05 06 2009 16 07 2009 copper densification hot pressing laser sintering powder metallurgy selective laser sintering isostatic pressing relative...
Journal Articles
Article Type: Research Papers
J. Manuf. Sci. Eng. August 2009, 131(4): 041003.
Published Online: July 7, 2009
... and modeling of pressure welding (solid state bonding) process are investigated, specifically for bonding of thin sheet metals. The effects of material type (e.g., copper, nickel, and stainless steel) and initial plate thickness ( 51 – 254 μ m ) as well as process conditions (e.g., welding pressure...
Journal Articles
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2009, 131(3): 031012.
Published Online: May 20, 2009
...A. Polar; J. E. Indacochea Friction stir welding (FSW) of electrolytic tough pitch copper plates was conducted using a conventional CNC milling machine. The microstructure evolution of the weld was correlated with the process parameters used in the study and in conjunction with increasing...
Journal Articles
Article Type: Technical Briefs
J. Manuf. Sci. Eng. February 2007, 129(1): 223–227.
Published Online: August 27, 2006
... of 1.5 - 2.5 μ m . Finally, suggestions for future work are presented that could potentially ameliorate current process problems. 08 12 2005 27 08 2006 surface roughness machining biotechnology microorganisms copper polishing scanning electron microscopy The use...
Journal Articles
Article Type: Technical Papers
J. Manuf. Sci. Eng. May 2005, 127(2): 394–401.
Published Online: April 25, 2005
.... The sensor is implemented in a copper Conform extrusion machine, and experimental results are presented, providing for the first time a detailed view of Conform Extrusion gap behavior during production. It is shown that the proposed gap-sensing and control system results in a number of advantages, including...
Journal Articles
Article Type: Technical Papers
J. Manuf. Sci. Eng. November 2004, 126(4): 653–658.
Published Online: February 4, 2005
... mechanism. Good results were obtained by using this press machine for burr-free blanking of 50 μm copper foil. Maeda , T. , 1954 , “ Reciprocating Blanking Method ,” Science of Machine , 10 ( 1 ), pp. 140 – 144 . Liebing , H. , and Lange , K. , 1977 , “ Blanking and Piercing...
Journal Articles
Article Type: Technical Papers
J. Manuf. Sci. Eng. May 2004, 126(2): 226–236.
Published Online: July 8, 2004
...Hongqiang Chen; Y. Lawrence Yao; Jeffrey W. Kysar Single crystal aluminum and copper of (001) and (110) orientation were shock peened using laser beam of 12 micron diameter and observed with X-ray micro-diffraction techniques based on a synchrotron light source. The X-ray micro-diffraction affords...
Journal Articles
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2004, 126(1): 10–17.
Published Online: March 18, 2004
... of such films. In this study, microscale LSP of copper films on single crystal silicon substrate is investigated. Before and after-process curvature measurement verifies that sizable compressive residual stress can be induced in copper thin films using microscale LSP. Improved modeling work of shock pressure...
Journal Articles
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2004, 126(1): 18–24.
Published Online: March 18, 2004
... characterization of shock treated copper thin films on single-crystal silicon substrates, where scanning x-ray microtopography is used to map the relative variation of the stress/strain field with micron spatial resolution, and instrumented nanoindentation is applied to measure the distribution of hardness...
Journal Articles
Article Type: Technical Briefs
J. Manuf. Sci. Eng. August 2003, 125(3): 628–630.
Published Online: July 23, 2003
...J. M. Rodrı´guez Lelis; J. Colı´n Ocempo; J. Porcayo Caldero´n; J. M. Robles In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns...
Journal Articles
Article Type: Technical Papers
J. Manuf. Sci. Eng. May 2002, 124(2): 369–378.
Published Online: April 29, 2002
...Wenwu Zhang; Y. Lawrence Yao Laser shock processing of copper using focused laser beam size about ten microns is investigated for its feasibility and capability to impart desirable residual stress distributions into the target material in order to improve the fatigue life of the material. Shock...
Journal Articles
Article Type: Technical Papers
J. Manuf. Sci. Eng. August 2001, 123(3): 521–527.
Published Online: January 1, 2000
...J. M. Lee; K. G. Watkins; W. M. Steen The laser cleaning of copper surfaces with a Nd:YAG Q -switched laser pulse for the improvement of solder quality on printed circuit boards (PCBs) has been monitored and characterized by sensing the acoustic emission during the process and one-dimensional...