In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature range from −40 to 150°C and stress range from 0.75 to 70 MPa. Based on dislocation and diffusion theories, two unified constitutive models were developed to describe the dislocation-controlled and diffusion-controlled creep behaviors observed. It was found that the two models accurately predict the experimental data. A deformation mechanism map was established for this eutectic solder alloy in order to interpret the creep mechanism under different temperature and loading conditions.
Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy
Contributed by the Materials Division for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received by the Materials Division November 22, 2001; revision received July 8, 2002. Associate Editor: E. Werner.
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Shi , X. Q., Wang , Z. P., Yang, Q. J., and Pang, H. L. J. (December 31, 2002). "Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy ." ASME. J. Eng. Mater. Technol. January 2003; 125(1): 81–88. https://doi.org/10.1115/1.1525254
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