The effect of texture on grain boundary character distribution (GBCD) in thermomechanically processed oxygen-free high-conductivity copper has been investigated. Copper samples were cold rolled to a reduction in thickness of 50% and then annealed for 60 min in the range of 400–600°C. GBCD and texture were measured using electron backscatter diffraction. The fraction of special boundaries (Σ3, Σ9, and Σ27) varied from 59% to 71%, with the maximum in the sample annealed at 500°C. The results indicate that cold rolling provided a strong texture of brass type. It was found that the sample annealed at 500°C have texture components of cube, Goss, rotated-Goss, and Y orientations. These texture components were in relation with the formation of annealing twins and Σ3 boundaries. It was also shown that twin-induced GBCD evolution occurred by strain-induced boundary migration, multiple twinning, and conventional recrystallization. Annealing at 600°C caused full recrystallization and grain growth, showing a strong cube recrystallization texture. The grain growth was found to hinder the formation of special boundaries.
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January 2012
Research Papers
Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper
Khaled J. Al-Fadhalah
Khaled J. Al-Fadhalah
Department of Mechanical Engineering, College of Engineering and Petroleum,
e-mail: fadhalah@kuc01.kuniv.edu.kw
Kuwait University
, P.O. Box 5969, Safat 13060, Kuwait
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Khaled J. Al-Fadhalah
Department of Mechanical Engineering, College of Engineering and Petroleum,
Kuwait University
, P.O. Box 5969, Safat 13060, Kuwait
e-mail: fadhalah@kuc01.kuniv.edu.kw
J. Eng. Mater. Technol. Jan 2012, 134(1): 011001 (9 pages)
Published Online: December 6, 2011
Article history
Received:
June 30, 2010
Revised:
March 6, 2011
Accepted:
March 7, 2011
Online:
December 6, 2011
Published:
December 6, 2011
Citation
Al-Fadhalah, K. J. (December 6, 2011). "Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper." ASME. J. Eng. Mater. Technol. January 2012; 134(1): 011001. https://doi.org/10.1115/1.4004069
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