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Keywords: copper
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Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. July 2021, 143(3): 031001.
Paper No: MATS-20-1257
Published Online: January 13, 2021
..., recently been developed. These models were used to predict tertiary creep for copper at 75 °C. In the present paper, these models are applied to creep tests at higher temperatures (215 and 250 °C). These results demonstrate again that tertiary creep in copper is primarily controlled accelerated recovery...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. January 2012, 134(1): 011007.
Published Online: December 8, 2011
.... The thermodynamic driving force for the transformation derives from the competition between the elastic energy of dislocations and the stacking fault energy. 26 07 2011 12 09 2011 08 12 2011 08 12 2011 copper dislocation energy dislocation interactions elasticity solid-state phase...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. January 2012, 134(1): 011001.
Published Online: December 6, 2011
...Khaled J. Al-Fadhalah The effect of texture on grain boundary character distribution (GBCD) in thermomechanically processed oxygen-free high-conductivity copper has been investigated. Copper samples were cold rolled to a reduction in thickness of 50% and then annealed for 60 min in the range of 400...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. April 2011, 133(2): 021007.
Published Online: March 4, 2011
...Yong Huang; Mason Morehead Various methods for the production of bulk nanostructured (NS)/ultrafine-grained (UFG) materials have been developed, including equal channel angular extrusion (ECAE), a form of severe plastic deformation. Using an ECAE NS/UFG copper bar as an example, this study has...
Journal Articles
Article Type: Technical Briefs
J. Eng. Mater. Technol. October 2010, 132(4): 044501.
Published Online: September 29, 2010
...A. Akbari-Fakhrabadi; R. Mahmudi; A. Karsaz; A. R. Geranmayeh The creep behavior of Cu–0.3Cr–0.1Ag alloy was investigated by the impression creep testing technique and compared with that of pure copper under constant punching stress in the range 80–550 MPa at temperatures in the range 688–855 K...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. April 2010, 132(2): 021014.
Published Online: February 22, 2010
...Christos F. Karanikas; Han Li; Joost J. Vlassak; James J. Watkins A fivefold increase in adhesion energy is observed for poly(acrylic acid) (PAA) modified Cu/TaN interfaces in which the thin copper films are deposited by the hydrogen assisted reduction of bis(2,2,7-trimethyloctane-3,5-dionato...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. April 2010, 132(2): 021009.
Published Online: February 18, 2010
... are the material parameters. The proposed model successfully describes not only the linear rise of flow stress with logarithmic strain rate for many metals, but also the upturn of the flow stress at strain rate over about 10 4 s − 1 for the case of copper. It can also describe the exponential increase in the flow...
Journal Articles
Article Type: Predictive Science And Technology In Mechanics And Materials
J. Eng. Mater. Technol. October 2009, 131(4): 041204.
Published Online: August 27, 2009
.... 02 02 2009 03 04 2009 27 08 2009 bicrystals copper crystal microstructure dislocations grain boundaries impurities molecular dynamics method nanostructured materials plastic deformation plasticity slip stress-strain relations grain boundaries atomistic simulation...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. July 2009, 131(3): 031013.
Published Online: June 4, 2009
...Russell J. McDonald; Christos Efstathiou; Peter Kurath The purpose of this work is to explore nonuniform plastic flow at small length- and time-scales. Pure single crystal copper tensile specimens were pulled along the [ 6 ¯ 5 6 ] crystal axis at three nominal strain-rates: 0.01%/s, 0.04%/s...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. July 2009, 131(3): 031005.
Published Online: May 22, 2009
... there is considerable strain hardening. The gradients found in the lattice rotations are far less pronounced than the sharp localizations in the displacement field. This highlights the importance of the rotations due to the activity of the slip systems. 10 09 2008 21 01 2009 22 05 2009 copper...
Journal Articles
Article Type: Shear Behavior And Related Mechanisms In Materials Plasticity
J. Eng. Mater. Technol. January 2009, 131(1): 011107.
Published Online: December 22, 2008
... on sheared and on extruded samples confirms that the extrusion promotes massively simple shear. Besides, the grain refinement is measured with a dedicated transmission electron microscopy (TEM) attachment. It is shown that the grain size decreases regularly for a low carbon steel as well as for copper, down...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. April 2008, 130(2): 021021.
Published Online: March 28, 2008
... elastic strain energy density is also examined. The effects of applying stress bound constraints on the SPF inversion are discussed, as are extensions of QSA to examine defect nucleation and propagation. 08 08 2007 23 01 2008 28 03 2008 copper crystal defects crystal...
Journal Articles
Article Type: Technical Papers
J. Eng. Mater. Technol. October 2007, 129(4): 505–512.
Published Online: April 9, 2007
.... A finite element is also run and compared with the two models proposed in this work. Results from both models are compared with available experimental results for oxygen-free high-conductivity copper and 1018 cold rolled steel, and both models show reasonably good agreement with the experimental results...
Journal Articles
Article Type: Technical Papers
J. Eng. Mater. Technol. April 2007, 129(2): 321–331.
Published Online: September 11, 2006
...Sathyan Subbiah; Shreyes N. Melkote Orthogonal cutting experiments using a quick-stop device are performed on Al2024-T3 and OFHC copper to study the chip–workpiece interface in a scanning electron microscope. Evidence of ductile tearing ahead of the tool at cutting speeds of 150 m ∕ min has been...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. April 2006, 128(2): 158–162.
Published Online: October 19, 2005
...Y. V. R. K. Prasad; K. P. Rao Processing map for the hot deformation of high purity oxygen free high conductivity (OFHC) copper ( 2 ppm oxygen) has been developed in the temperature range 600 - 950 ° C and strain rate range 0.001 - 100 s − 1 . The map is compared with those published earlier...
Journal Articles
Article Type: Technical Briefs
J. Eng. Mater. Technol. April 2006, 128(2): 248–252.
Published Online: July 5, 2005
... confirmed through fractographs. Hence it can be said that this technique eliminates the need for fractographs when determining the mode of damage during creep-fatigue interaction. 17 06 2004 05 07 2005 copper creep fatigue stress-strain relations hysteresis creep testing fatigue...
Journal Articles
Article Type: Research Papers
J. Eng. Mater. Technol. July 2005, 127(3): 295–300.
Published Online: March 16, 2005
...Agnieszka M. Wusatowska-Sarnek Initial stage of dynamic recrystallization (DRX) under warm and hot deformation was investigated in polycrystalline copper. At the onset of DRX at intermediate deformation temperatures (i.e., high values of Zener–Hollomon parameter Z ) large orientation gradients...
Journal Articles
Article Type: Special Section On Nanomaterials And Nanomechanics
J. Eng. Mater. Technol. October 2005, 127(4): 423–433.
Published Online: March 7, 2005
... to a novel shape memory effect to Cu nanowires not seen in bulk Cu. 02 01 2005 07 03 2005 copper nanowires elasticity molecular dynamics method crystal orientation twin boundaries martensitic transformations elongation shape memory effects Nanocomponents are of great...
Journal Articles
Article Type: Special Section On Nanomaterials And Nanomechanics
J. Eng. Mater. Technol. October 2005, 127(4): 400–407.
Published Online: February 22, 2005
... to pure Cu and the results are compared with various experimental data. 13 09 2004 22 02 2005 copper deformation nanostructured materials inclusions grain boundaries slip nanocrystalline materials homogenization composite materials Hall–Petch The field...
Journal Articles
Article Type: Special Section On Nanomaterials And Nanomechanics
J. Eng. Mater. Technol. October 2005, 127(4): 451–456.
Published Online: February 22, 2005
...Yong Gan; Dongyun Lee; Xi Chen; Jeffrey W. Kysar Nanocomposite thin films which consist of 50 nm Al 2 O 3 nanoparticles in a copper metal matrix were deposited on a silicon wafer. The thickness of the nanocomposite thin films was about 3 microns and the volume density of the nanoparticles...