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A-F. Bastawros
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Proceedings Papers

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

A.-F. Bastawros, A. G. Evans
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 1-6, November 16–21, 1997
Paper No: IMECE1997-1208
DOI: https://doi.org/10.1115/IMECE1997-1208
View Paper titled, Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices
Click here to open pdf in another window PDF for Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices
Topics: Aluminum alloys, Foams (Chemistry), Heat sinks, Cross-flow, Cylinders, Dimensions, Fluid dynamics, Fluids, Heat transfer coefficients, Pressure drop
Journal Articles

Mechanistic Understanding of Material Detachment During Micro-Scale Polishing

W. Che, Y. Guo, A. Chandra, A-F. Bastawros
Journal: Journal of Manufacturing Science and Engineering
Article Type: Technical Papers
J. Manuf. Sci. Eng. November 2003, 125(4): 731–735.
DOI: https://doi.org/10.1115/1.1619964
Published Online: November 11, 2003
View Article titled, Mechanistic Understanding of Material Detachment During Micro-Scale Polishing
Click here to open pdf in another window PDF for Mechanistic Understanding of Material Detachment During Micro-Scale Polishing
Topics: Microscale devices, Polishing, Shear (Mechanics), Particulate matter, Finite element methods, Finite element model, Copper, Finite element analysis
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
DOI: https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
Click here to open pdf in another window PDF for Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

A. F. Bastawros, A. S. Voloshin
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 303–308.
DOI: https://doi.org/10.1115/1.2904382
Published Online: December 1, 1990
View Article titled, Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry
Click here to open pdf in another window PDF for Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry
Topics: Electronic packages, Interferometry, Strain measurement, Displacement, Deformation, Diffraction patterns, Microelectronic devices, Resolution (Optics), Temperature, Thermomechanics