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Proceedings Papers

Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment

K. Darbha, A. Poddar, C. S. Sealing, C. Ramaswamy, L. Tang, K. Upadhayayula, A. Dasgupta, Y. Joshi
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 153-178, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0785
https://doi.org/10.1115/IMECE1996-0785
View Paper titled, Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment
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Topics: Process simulation, Surface mount packaging, Manufacturing, Solders, Design, Geometry, Modeling, Cycles, Solder joints, Warping
Proceedings Papers

Some Investigations on Flow Through Chevrons of Moisture Separator and Reheater Used in Nuclear Power Plants

V. Keshava Iyer, A. Dasgupta, B. Venkat Rao, R. Srivastava
Proc. ASME. IMECE97, Fluids Engineering, 381-386, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0796
https://doi.org/10.1115/IMECE1997-0796
View Paper titled, Some Investigations on Flow Through Chevrons of Moisture Separator and Reheater Used in Nuclear Power Plants
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Topics: Flow (Dynamics), Nuclear power stations, Molten salt reactors, Water, Air flow, Drops, Pressure drop, Probes, Internal flow, Iron
Proceedings Papers

A Generalized Laminate Model for Electro-Mechanical Plates and Shells

C. S. Sealing, A. Dasgupta
Proc. ASME. IMECE2000, Adaptive Structures and Material Systems, 165-172, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1702
https://doi.org/10.1115/IMECE2000-1702
View Paper titled, A Generalized Laminate Model for Electro-Mechanical Plates and Shells
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Topics: Laminates, Plates (structures), Shells, Finite element analysis, Electric fields, Materials properties
Proceedings Papers

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 145-151, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2256
https://doi.org/10.1115/IMECE2000-2256
View Paper titled, Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects
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Topics: Durability, Failure mechanisms, Absorption, Cracking (Materials), Diffusion (Physics), Engineering simulation, Finite element analysis, Fracture (Process), Intermetallic compounds, Life testing
Proceedings Papers

Bond Strength Models for Adhesively Bonded Flip-Chip Interconnects

K. Sinha, A. Dasgupta, J. Caers
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 447-457, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89442
https://doi.org/10.1115/IMECE2012-89442
View Paper titled, Bond Strength Models for Adhesively Bonded Flip-Chip Interconnects
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Topics: Bond strength, Flip-chip
Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041012.
https://doi.org/10.1115/1.4005091
Published Online: December 9, 2011
View Article titled, Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results
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Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties
Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041010.
https://doi.org/10.1115/1.4005090
Published Online: December 9, 2011
View Article titled, Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results
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Topics: Printed circuit boards, Shock (Mechanics), Manufacturing
Journal Articles

Characterization of Crack Arrest Phenomena in a Modified 9Cr-1Mo Steel

S. Sathyanarayanan, A. Moitra, G. Sasikala, A. Dasgupta, S. Saroja, A. K. Bhaduri, Baldev Raj, Vakil Singh
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. May 2011, 39(3): 448–455.
https://doi.org/10.1520/JTE103048
Published Online: May 1, 2011
View Article titled, Characterization of Crack Arrest Phenomena in a Modified 9Cr-1Mo Steel
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Proceedings Papers

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 143-148, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89178
https://doi.org/10.1115/InterPACK2009-89178
View Paper titled, Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects
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Topics: Accelerometers, Approximation, Bending (Stress), Damage, Durability, Fatigue, Finite element analysis, Manufacturing, Printed circuit boards, Random excitation
Proceedings Papers

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta, S. Tolchinsky, J. Crystal
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 149-154, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89179
https://doi.org/10.1115/InterPACK2009-89179
View Paper titled, Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems
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Topics: Electronic systems, Modeling, Shock (Mechanics), Simulation, Dynamic response, Batteries, Plastic housings, Circuits, Design, Dynamic testing (Materials)
Proceedings Papers

Test Methodologies for Power Cycling Experiment

K. Sinha, M. Al-Bassyiouni, P. Hansen, A. Dasgupta, P. McCluskey, R. Beaupre, J. Jacobsen
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 35-44, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11074
https://doi.org/10.1115/IMECE2009-11074
View Paper titled, Test Methodologies for Power Cycling Experiment
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Topics: Computer software, Cooling systems, Cycles, Durability, Electronics, Hardware, Heat, Junctions, Semiconductor devices, Stress
Proceedings Papers

Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects

K. Sinha, D. Farley, T. Kahnert, S. Solares, A. Dasgupta, J. F. J. Caers, X. J. Zhao
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 29-34, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12650
https://doi.org/10.1115/IMECE2009-12650
View Paper titled, Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects
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Topics: Flip-chip, Welding, Temperature, Adhesives, Bonding, Low temperature, Modeling, Bond strength, Compression, Cycles
Proceedings Papers

System-Level Reliability Qualification of Complex Electronic Systems

D. Farley, A. Dasgupta, M. Al-Bassyiouni, J. W. C. de Vries
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 231-237, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11762
https://doi.org/10.1115/IMECE2009-11762
View Paper titled, System-Level Reliability Qualification of Complex Electronic Systems
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Topics: Electronic systems, Reliability, Cycles, Durability, Failure mechanisms, Simulation, Failure, Stress, Accelerometers, Engineering standards
Proceedings Papers

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 515-521, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33095
https://doi.org/10.1115/IPACK2007-33095
View Paper titled, SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions
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Topics: Durability, Temperature, Vibration, Solders, Damage, Finite element analysis, High cycle fatigue, Printed circuit boards, Electrical wires, Excitation
Proceedings Papers

Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules

K. Sinha, A. Dasgupta, R. Beaupre, A. Gowda
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 87-93, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67367
https://doi.org/10.1115/IMECE2008-67367
View Paper titled, Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules
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Topics: Copper, Silicon, Strength (Materials), Stress, Delamination, Risk, Thermomechanics, Adhesion, Degrees of freedom, Failure mechanisms
Proceedings Papers

Partitioned Cyclic Fatigue Damage Evolution Model for PB-Free Solder Materials

Leila J. Ladani, A. Dasgupta
Proc. ASME. PVP2007, Volume 9: Eighth International Conference on Creep and Fatigue at Elevated Temperatures, 119-125, July 22–26, 2007
Publisher: American Society of Mechanical Engineers
Paper No: CREEP2007-26306
https://doi.org/10.1115/CREEP2007-26306
View Paper titled, Partitioned Cyclic Fatigue Damage Evolution Model for PB-Free Solder Materials
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Topics: Constitutive equations, Damage, Fatigue damage, Lead-free solders, Stress, Creep, Deformation, Dislocations, Microscale devices, Diffusion (Physics)
Proceedings Papers

An Analytic Model for PTH/PWB Stress Due to Three-Dimensional Forces Generated by Symmetric Compliant-Pins

S. Roettele, A. Dasgupta
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 407-411, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43491
https://doi.org/10.1115/IMECE2007-43491
View Paper titled, An Analytic Model for PTH/PWB Stress Due to Three-Dimensional Forces Generated by Symmetric Compliant-Pins
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Topics: Pins (Engineering), Printed circuit boards, Stress, Design, Geometry, Construction, Deformation, Fourier series, Friction, Materials properties
Proceedings Papers

Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending

D. Farley, Y. Zhou, A. Dasgupta, J. F. J. Caers, J. W. C. de Vries
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 451-458, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43898
https://doi.org/10.1115/IMECE2007-43898
View Paper titled, Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending
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Topics: Bending (Stress), Design, Engineering simulation, Epoxy adhesives, Epoxy resins, Failure, Failure analysis, Failure mechanisms, Fatigue, Flip-chip
Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 845-848, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73014
https://doi.org/10.1115/IPACK2005-73014
View Paper titled, Failure Site Transition During Drop Testing of Printed Wiring Assemblies
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Topics: Electrical wires, Failure, Testing, Durability, Intermetallic compounds, Solders, Damage, Surface mount packaging, Brittleness, Deformation
Journal Articles

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
https://doi.org/10.1115/1.3078195
Published Online: February 25, 2009
View Article titled, Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
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Topics: Durability, Excitation, Fatigue, Printed circuit boards, Solders, Vibration, Finite element analysis, Failure