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Ajay P. Malshe
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Journal Articles

Special Issue: In-Space Manufacturing

Ajay P. Malshe, Rob Ambrose, Greg Autry, Salil Bapat, Rose Hernandez, Joel Mozer, Jana Stoudemire, John Vickers
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Guest Editorial
J. Manuf. Sci. Eng. December 2024, 146(12): 120301.
Paper No: MANU-24-1800
https://doi.org/10.1115/1.4067390
Published Online: December 19, 2024
View Articletitled, Special Issue: In-Space Manufacturing
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Topics: Manufacturing
Journal Articles

Ultrasonic Levitation as a Handling Tool for In-Space Manufacturing Processes

Jan Raffel, Torben Böhm, Jan Düsing, Marvin Röhl, Carsten Schilde, Ajay P. Malshe, Ludger Overmeyer, Christoph Lotz
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. December 2024, 146(12): 121001.
Paper No: MANU-24-1284
https://doi.org/10.1115/1.4066335
Published Online: September 19, 2024
View Articletitled, Ultrasonic Levitation as a Handling Tool for In-Space Manufacturing Processes
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Topics: Acoustics, Gravity (Force), Levitation, Manufacturing, Particulate matter, Simulation, Wavelength, Lasers, Melting, Digital twin
Journal Articles

Frugal Engineering

Ajay P. Malshe, Salil Bapat, Lukas Fischer
Journal: Mechanical Engineering
Publisher: ASME
Article Type: Research-Article
Mechanical Engineering. May 2024, 146(3): 28–33.
Paper No: ME-2024-May1
https://doi.org/10.1115/1.2024-May1
Published Online: May 1, 2024
View Articletitled, Frugal Engineering
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Topics: Biology, Design, Engineers, Innovation, Supply chains, Water, Performance, Biomimetics, Resilience, Manufacturing
Journal Articles

Editorial

Ajay P. Malshe, Albert Shih
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Editorial
J. Manuf. Sci. Eng. May 2023, 145(5): 050201.
Paper No: MANU-23-1143
https://doi.org/10.1115/1.4057045
Published Online: March 28, 2023
View Articletitled, Editorial
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Topics: Manufacturing, Mechanical engineering, Economics
Journal Articles

Understanding Frugal Engineering for Equity: Exploring Convergence of Biological Designs and Social Innovations

Ajay P. Malshe, Salil Bapat, Lukas Fischer
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Review Articles
J. Manuf. Sci. Eng. May 2023, 145(5): 050801.
Paper No: MANU-22-1358
https://doi.org/10.1115/1.4056666
Published Online: February 7, 2023
View Articletitled, Understanding Frugal Engineering for Equity: Exploring Convergence of Biological Designs and Social Innovations
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Topics: Innovation, Manufacturing, Resilience, Sustainability, Biology, Design, Water, Natural, scientific and engineering processes and practices
Journal Articles

Understanding the Role of Directional Texture in Tribofilm Evolution

Salil Bapat, Ajay P. Malshe
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. December 2022, 144(12): 122201.
Paper No: TRIB-22-1179
https://doi.org/10.1115/1.4055405
Published Online: September 26, 2022
View Articletitled, Understanding the Role of Directional Texture in Tribofilm Evolution
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Topics: Disks, Lubricants, Lubrication, Surface texture, Texture (Materials), Tribological films, Tribology, Wear, Tribochemistry, Friction
Proceedings Papers

Preliminary Results of Laser-Assisted Cleaning of Alumina Coated Carbide Tool Inserts

Ajay P. Malshe, Kok E. Khor, Deepak G. Bhat
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 207-212, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1154
https://doi.org/10.1115/IMECE1997-1154
View Paper titled, Preliminary Results of Laser-Assisted Cleaning of Alumina Coated Carbide Tool Inserts
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Topics: Lasers, Carbide cutting tools, Coating processes, Coatings, Blasting, Chemical vapor deposition, Cobalt, Cutting, Cutting tools, Damage
Proceedings Papers

3-D FEM of Residual Stresses in CVD Diamond-Coated Carbide Cutting Inserts for Process Optimization

Mahmoud A. Taher, William F. Schmidt, Ajay P. Malshe
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 429-438, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1056
https://doi.org/10.1115/IMECE1998-1056
View Paper titled, 3-D FEM of Residual Stresses in CVD Diamond-Coated Carbide Cutting Inserts for Process Optimization
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Topics: Chemical vapor deposition, Cutting, Diamonds, Finite element model, Optimization, Residual stresses, Coatings, Adhesion, Stress, Synthetic diamonds
Journal Articles

Applications of Hybrid Manufacturing during COVID-19 Pandemic: Pathway to Convergent Manufacturing

Salil Bapat, Michael P. Sealy, Kamlakar P. Rajurkar, Tom Houle, Kimberly Sablon, Ajay P. Malshe
Journal: Smart and Sustainable Manufacturing Systems
Publisher: ASTM International
Article Type: Technical Notes
Smart Sustain. Manuf. Syst.. April 2022, 6(1): 12–22.
Paper No: SSMS20210022
https://doi.org/10.1520/SSMS20210022
Published Online: January 12, 2022
View Articletitled, Applications of Hybrid Manufacturing during COVID-19 Pandemic: Pathway to Convergent Manufacturing
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Journal Articles

Cellular Agriculture: An Outlook on Smart and Resilient Food Agriculture Manufacturing

Salil Bapat, Vishvesh Koranne, Neha Shakelly, Aihua Huang, Michael P. Sealy, John W. Sutherland, Kamlakar P. Rajurkar, Ajay P. Malshe
Journal: Smart and Sustainable Manufacturing Systems
Publisher: ASTM International
Article Type: Technical Notes
Smart Sustain. Manuf. Syst.. April 2022, 6(1): 1–11.
Paper No: SSMS20210020
https://doi.org/10.1520/SSMS20210020
Published Online: January 11, 2022
View Articletitled, Cellular Agriculture: An Outlook on Smart and Resilient Food Agriculture Manufacturing
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Proceedings Papers

Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study

Ajit R. Dhamdhere, W. F. Schmidt, Ajay P. Malshe, W. D. Brown, S. N. Yedave
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 193-200, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24724
https://doi.org/10.1115/IMECE2001/EPP-24724
View Paper titled, Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study
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Topics: Failure mechanisms, Lasers, Modeling, Optical instruments, Packaging, Power semiconductor devices, Reliability, Semiconductor lasers, Solders, Stress
Proceedings Papers

Design and Fabrication of a Cellular Motor Driven Micro Fluidic System

Jedediah J. Young, Chuen-Cheak Lee, Ajay P. Malshe, Steve Tung, Michael D. Manson
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 471-477, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23869
https://doi.org/10.1115/IMECE2001/MEMS-23869
View Paper titled, Design and Fabrication of a Cellular Motor Driven Micro Fluidic System
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Topics: Design, Manufacturing, Microchannels, Microelectromechanical systems, Motors
Proceedings Papers

Laser-Assisted Surface Engineering of Silicon Nitride to Minimize the Surface Defects Generated During Grinding Operation: Part I

Palaniappan Chinnakaruppan, Ajay P. Malshe, Sharad N. Yedave, Beom Soo Park, William F. Schimdt, Matthew H. Gordon, Stephen A. Batzer, William D. Brown
Proc. ASME. IMECE2000, Manufacturing Engineering, 959-966, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1903
https://doi.org/10.1115/IMECE2000-1903
View Paper titled, Laser-Assisted Surface Engineering of Silicon Nitride to Minimize the Surface Defects Generated During Grinding Operation: Part I
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Topics: Grinding, Lasers, Silicon nitride ceramics, Surface engineering, Bending strength, Carbon dioxide, Abrasive machining, Annealing, Bearings, Cavities
Proceedings Papers

Reactive Processing of CVD Diamond Substrates in Liquid Ambient by Second Harmonic of Nd:YAG Laser

Beom S. Park, Ajay P. Malshe, William D. Brown, Kiran P. Adhi
Proc. ASME. IMECE2000, Manufacturing Engineering, 245-249, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1814
https://doi.org/10.1115/IMECE2000-1814
View Paper titled, Reactive Processing of CVD Diamond Substrates in Liquid Ambient by Second Harmonic of Nd:YAG Laser
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Topics: Nd-YAG lasers, Synthetic diamonds, Diamonds, Water, Drilling, Laser beams, Deformation, Hydrogen, Lasers, Microcracks
Journal Articles

Quo Vadimus : Humanism, Going Beyond the Boundaries of Capitalism and Socialism

Ajay P. Malshe, Salil Bapat
Journal: Smart and Sustainable Manufacturing Systems
Publisher: ASTM International
Article Type: Technical Notes
Smart Sustain. Manuf. Syst.. December 2020, 4(3): 338–340.
Paper No: SSMS20200060
https://doi.org/10.1520/SSMS20200060
Published Online: December 16, 2020
View Articletitled, Quo Vadimus : Humanism, Going Beyond the Boundaries of Capitalism and Socialism
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Proceedings Papers

Chemical Understanding of Friction Polymer Based Tribo-Chemical Films Derived From Nanolubricant

Wenyang Zhang, Muhammad P. Jahan, Ajay P. Malshe
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 13-15, October 7–10, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2012-61119
https://doi.org/10.1115/IJTC2012-61119
View Paper titled, Chemical Understanding of Friction Polymer Based Tribo-Chemical Films Derived From Nanolubricant
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Topics: Friction, Polymers, Tribological films, Wear, Lubrication, Bonding, Boundary lubrication, Microscopes, Nanoparticles, Photoelectron spectroscopy
Proceedings Papers

Development of Thermal Interface Materials for Harsh Environment Packaging of Superconducting Integrated Circuits

Corey Thompson, Matt Gordon, Ajay P. Malshe, Deep Gupta
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 253-261, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40527
https://doi.org/10.1115/IMECE2010-40527
View Paper titled, Development of Thermal Interface Materials for Harsh Environment Packaging of Superconducting Integrated Circuits
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Topics: Integrated circuits, Nanocomposites, Packaging, Thermal management
Journal Articles

Pulse Breakdown in Sub-20 nm Organic Dielectrics for Nanoscale-Electromachining (nano-EM)

Kumar R. Virwani, Ajay P. Malshe, Kamlakar P. Rajurkar
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Special Issue On Nanomanufacturing
J. Manuf. Sci. Eng. June 2010, 132(3): 030915.
https://doi.org/10.1115/1.4001718
Published Online: June 9, 2010
View Articletitled, Pulse Breakdown in Sub-20 nm Organic Dielectrics for Nanoscale-Electromachining (nano-EM)
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Topics: Dielectric materials, Electric fields, Flow (Dynamics), Machining, Nanoscale phenomena, Tungsten, Manufacturing, Compression
Proceedings Papers

Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of MEMS-Based Mechanical System-on-a-Chip (SOAC) for Nanomanufacturing

Chad B. O’Neil, Ajay P. Malshe, Kumar Virwani, William F. Schmidt
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 529-534, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39381
https://doi.org/10.1115/IMECE2002-39381
View Paper titled, Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of MEMS-Based Mechanical System-on-a-Chip (SOAC) for Nanomanufacturing
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Topics: Design, Microelectromechanical systems, Modeling, Nanomanufacturing, Tolerance analysis
Proceedings Papers

Laser Bonding and Modeling for Wafer-Level and Chip-Scale Packaging of Micro-Electro-Mechanical Systems

Yi Tao, Ajay P. Malshe, W. D. Brown
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 55-60, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39271
https://doi.org/10.1115/IMECE2002-39271
View Paper titled, Laser Bonding and Modeling for Wafer-Level and Chip-Scale Packaging of Micro-Electro-Mechanical Systems
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Topics: Bonding, Lasers, MEMS packaging, Microelectromechanical systems, Modeling, Semiconductor wafers, Vacuum