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Proceedings Papers

Characterization of Thin-Film Impact Microactuators

Roger L. Hipwell, Richard S. Muller, Albert P. Pisano

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 87-91, November 16–21, 1997

Paper No: IMECE1997-0944

DOI: https://doi.org/10.1115/IMECE1997-0944

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Topics: Microactuators, Thin films, Actuators, Design, Displacement, Impulse (Physics), Micromachining, Microscale devices, Momentum

Proceedings Papers

Fabrication of a Free Floating Silicon Gate Valve

Alexandros P. Papavasiliou, Dorian Liepmann, Albert P. Pisano

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 435-440, November 14–19, 1999

Paper No: IMECE1999-0302

DOI: https://doi.org/10.1115/IMECE1999-0302

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Topics: Gates (Closures), Manufacturing, Silicon, Valves, Semiconductor wafers, Epoxy adhesives, Epoxy resins, Bonding, Bubbles, Etching

Proceedings Papers

An Integrated Microfluidic Device for the Continuous Sampling and Analysis of Biological Fluids

Jeffrey D. Zahn, Ajay A. Deshmukh, Alexandros P. Papavasiliou, Albert P. Pisano, Dorian Liepmann

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 787-792, November 11–16, 2001

Paper No: IMECE2001/MEMS-23912

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23912

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Topics: Fluids, Microelectromechanical systems, Microfluidics, Sensors, Enzymes, Microneedles, Proteins, Biosensors, Molecular weight, Displacement

Proceedings Papers

Modeling of a Finger-Follower Cam System With Verification in Contact Forces

Wensyang Hsu, Albert P. Pisano

Proc. ASME. DETC93, 14th Biennial Conference on Mechanical Vibration and Noise: Vibrations and Dynamics of Robotic and Multibody Structures, 29-38, September 19–22, 1993

Paper No: DETC1993-0141

DOI: https://doi.org/10.1115/DETC1993-0141

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Topics: Algorithms, Camshafts, Compressibility, Coulombs, Dynamic models, Dynamic response, Friction, Modeling, Oscillations, Simulation results

Proceedings Papers

Modeling of a Hydraulic Lash Adjuster With Experimental Identification in Oil Refill Mechanism

Wensyang Hsu, Albert P. Pisano

Proc. ASME. DETC94, 20th Design Automation Conference: Volume 1 — Dynamic Mechanical Systems; Geometric Modeling and Features; Concurrent Engineering, 475-485, September 11–14, 1994

Paper No: DETC1994-0090

DOI: https://doi.org/10.1115/DETC1994-0090

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Topics: Air entrainment, Clearances (Engineering), Compressibility, Differential equations, Dynamic models, Leakage, Modeling, Nonlinear differential equations, Pumps, Stiffness

Proceedings Papers

Stepper Motor Driven Four-Bar: Dynamic Modeling and Synthesis

Sern-Hong Wang, Albert P. Pisano

Proc. ASME. DETC-CIE96, Volume 3: 22nd Design Automation Conference, V003T03A049, August 18–22, 1996

Paper No: 96-DETC/DAC-1605

DOI: https://doi.org/10.1115/96-DETC/DAC-1605

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Topics: Dynamic modeling, Stepper motors, Inertia (Mechanics), Torque, Engines, Motors, Circuits, Differential equations, Dynamic models, Dynamic response

Proceedings Papers

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A006, July 6–9, 2015

Paper No: IPACK2015-48449

DOI: https://doi.org/10.1115/IPACK2015-48449

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Topics: Nanoparticles, Printing, Inks, Sorption, Fluid dynamics, Fluids, Molding, Vapors, Diffusion (Physics), Engineering simulation

Proceedings Papers

Comparison of Microscale Rapid Prototyping Techniques for Microfluidic Applications

Gordon D. Hoople, David A. Rolfe, Katherine C. McKinstry, Joanna R. Noble, David A. Dornfeld, Albert P. Pisano

Proc. ASME. MSEC2014, Volume 1: Materials; Micro and Nano Technologies; Properties, Applications and Systems; Sustainable Manufacturing, V001T03A001, June 9–13, 2014

Paper No: MSEC2014-3932

DOI: https://doi.org/10.1115/MSEC2014-3932

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Topics: Microfluidics, Microscale devices, Rapid prototyping, Laser ablation, Additive manufacturing, Micromilling, Surface roughness, Dimensions, Finishes, Optical microscopes

Journal Articles

Comparison of Microscale Rapid Prototyping Techniques

Gordon D. Hoople, David A. Rolfe, Katherine C. McKinstry, Joanna R. Noble, David A. Dornfeld, Albert P. Pisano

J. Micro Nano-Manuf. September 2014, 2(3): 034502.

Paper No: JMNM-14-1018

DOI: https://doi.org/10.1115/1.4027810

Published Online: July 8, 2014

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Topics: Ablation (Vaporization technology), Additive manufacturing, Carbon dioxide lasers, Laser ablation, Manufacturing, Micromilling, Microscale devices, Rapid prototyping, Surface roughness, Microfluidics

Proceedings Papers

Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a Vertically Wicking Micro-Columnated Loop Heat Pipe

Navdeep S. Dhillon, Chris Hogue, Matthew W. Chan, Jim C. Cheng, Albert P. Pisano

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 297-306, November 11–17, 2011

Paper No: IMECE2011-64676

DOI: https://doi.org/10.1115/IMECE2011-64676

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Topics: Heat pipes, Manufacturing, Microelectromechanical systems, Silicon, Semiconductor wafers, Etching, Evaporation, Thin films, Design, Condensers (steam plant)

Proceedings Papers

Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe

Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 963-971, November 11–17, 2011

Paper No: IMECE2011-64944

DOI: https://doi.org/10.1115/IMECE2011-64944

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Topics: Fluids, Heat flux, Heat pipes, Microscale devices, Packaging, Microelectromechanical systems, Semiconductor wafers, Aluminum, Bonding, Borosilicate glasses

Proceedings Papers

Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure

Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 667-677, November 11–17, 2011

Paper No: IMECE2011-65057

DOI: https://doi.org/10.1115/IMECE2011-65057

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Topics: Evaporation, Heat transfer, Microscale devices, Silicon, Steady state, Thin films, Vapors, Algorithms, Design, Fluid dynamics

Proceedings Papers

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano

Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1121-1129, November 11–17, 2011

Paper No: IMECE2011-64698

DOI: https://doi.org/10.1115/IMECE2011-64698

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Topics: Design, Heat pipes, Microscale devices, Flow (Dynamics), Heat, Finite element analysis, Fluids, Heat conduction, Leakage, Microfabrication

Proceedings Papers

Piezo Thermoelastic Model for Quality Factor Optimization of Resonant Rings

Gabriele Vigevani, David R. Myers, Albert P. Pisano

Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 255-261, November 12–18, 2010

Paper No: IMECE2010-39944

DOI: https://doi.org/10.1115/IMECE2010-39944

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Topics: Optimization, Q-factor, Resonance, Thermoelasticity, Approximation, Computation, Constitutive equations, Geometry

Proceedings Papers

MEMS Sensors for Down-Hole Monitoring of Geothermal Energy Systems

Sarah Wodin-Schwartz, Matthew W. Chan, Kirti Ramesh Mansukhani, Albert P. Pisano, Debbie G. Senesky

Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 965-972, August 7–10, 2011

Paper No: ES2011-54699

DOI: https://doi.org/10.1115/ES2011-54699

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Topics: Geothermal power, Microelectromechanical systems, Sensors, Design, Geothermal engineering, Temperature, Bonding, Manufacturing, Packaging, Pressure

Proceedings Papers

Low Temperature OFET (Organic Field Effect Transistor) Fabrication by Metal Nanoparticle Imprinting

Seung Hwan Ko, Inkyu Park, Heng Pan, Albert P. Pisano, Costas P. Grigoropoulos

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 947-953, July 8–12, 2007

Paper No: IPACK2007-33448

DOI: https://doi.org/10.1115/IPACK2007-33448

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Topics: Low temperature, Manufacturing, Metals, Nanoparticles, Transistors

Proceedings Papers

MLHP: A High Heat Flux Localized Cooling Technology for Electronic Substrates

Navdeep S. Dhillon, Albert P. Pisano, Christopher Hogue, Matthew A. Hopcroft

Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 621-630, October 31–November 6, 2008

Paper No: IMECE2008-66993

DOI: https://doi.org/10.1115/IMECE2008-66993

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Topics: Cooling, Heat flux, Design, Computer simulation, Microchannels, Microscale devices, Physics, Condensers (steam plant), Fluid dynamics, Heat

Proceedings Papers

Enhanced Cross-Axis Rejection Capacitive Strain Gauge

Babak Jamshidi, Robert G. Azevedo, Anand V. Jog, Albert P. Pisano

Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 535-539, November 11–15, 2007

Paper No: IMECE2007-43168

DOI: https://doi.org/10.1115/IMECE2007-43168

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Topics: Strain gages, Noise (Sound), Capacitance, Shear (Mechanics), Silicon-on-insulator, Capacitors, Deflection, Electronics, Engineering simulation, Errors

Proceedings Papers

Micro/Nanoscale Structure Fabrication by Direct Nanoimprinting of Metallic and Semiconducting Nanoparticles

Inkyu Park, Seung H. Ko, Heng Pan, Albert P. Pisano, Costas P. Grigoropoulos

Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 307-314, November 11–15, 2007

Paper No: IMECE2007-43878

DOI: https://doi.org/10.1115/IMECE2007-43878

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Topics: Manufacturing, Nanoparticles, Nanoscale phenomena, Electronic components, Low temperature, Metals, Plasma desorption mass spectrometry, Pressure, Quantum dots, Resistors

Proceedings Papers

Nanoscale Joule Heating Along Silicon Nanowire and Its Nanoscale Heater Application

Inkyu Park, Zhiyong Li, Albert P. Pisano, R. Stanley Williams

Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 1101-1107, November 11–15, 2007

Paper No: IMECE2007-43099

DOI: https://doi.org/10.1115/IMECE2007-43099

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Topics: Heating, Joules, Nanoscale phenomena, Nanowires, Silicon, Temperature, Ablation (Vaporization technology), Atomic force microscopy, Computer simulation, Electric potential

Journal citation

NARROW

Characterization of Thin-Film Impact Microactuators

Fabrication of a Free Floating Silicon Gate Valve

An Integrated Microfluidic Device for the Continuous Sampling and Analysis of Biological Fluids

Modeling of a Finger-Follower Cam System With Verification in Contact Forces

Modeling of a Hydraulic Lash Adjuster With Experimental Identification in Oil Refill Mechanism

Stepper Motor Driven Four-Bar: Dynamic Modeling and Synthesis

A Model to Guide Template-Based Nanoparticle Printing Development

Comparison of Microscale Rapid Prototyping Techniques for Microfluidic Applications

Comparison of Microscale Rapid Prototyping Techniques

Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a Vertically Wicking Micro-Columnated Loop Heat Pipe

Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe

Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

Piezo Thermoelastic Model for Quality Factor Optimization of Resonant Rings

MEMS Sensors for Down-Hole Monitoring of Geothermal Energy Systems

Low Temperature OFET (Organic Field Effect Transistor) Fabrication by Metal Nanoparticle Imprinting

MLHP: A High Heat Flux Localized Cooling Technology for Electronic Substrates

Enhanced Cross-Axis Rejection Capacitive Strain Gauge

Micro/Nanoscale Structure Fabrication by Direct Nanoimprinting of Metallic and Semiconducting Nanoparticles

Nanoscale Joule Heating Along Silicon Nanowire and Its Nanoscale Heater Application

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