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Amy Marconnet
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Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011008.
Paper No: EP-20-1121
DOI: https://doi.org/10.1115/1.4050200
Published Online: August 6, 2021
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Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction
Journal Articles

Experimental Investigation of Composite Phase Change Material Heat Sinks for Enhanced Passive Thermal Management

Collier S. Miers, Amy Marconnet
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. January 2021, 143(1): 013001.
Paper No: HT-19-1689
DOI: https://doi.org/10.1115/1.4048620
Published Online: November 4, 2020
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Topics: Composite materials, Design, Heat, Heat sinks, Melting, Phase change materials, Temperature, Thermal management, Cycles, Thermal conductivity
Journal Articles

Uncertainty Propagation Through a Simulation of Industrial High Pressure Die Casting

Jiahong Fu, John Coleman, Gregory Poole, Matthew John M. Krane, Amy Marconnet
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. November 2019, 141(11): 112101.
Paper No: HT-18-1434
DOI: https://doi.org/10.1115/1.4044514
Published Online: September 16, 2019
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Topics: Uncertainty, Uncertainty quantification, Boundary-value problems, Simulation, Die casting (Process), High pressure (Physics), Solidification
Journal Articles

Infrared Microscopy Enhanced Ångström's Method for Thermal Diffusivity of Polymer Monofilaments and Films

Jaesik Hahn, Tahira Reid, Amy Marconnet
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. August 2019, 141(8): 081601.
Paper No: HT-18-1384
DOI: https://doi.org/10.1115/1.4043619
Published Online: June 12, 2019
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Topics: Temperature, Thermal diffusivity, Emissivity, Polymers, Heating, Vacuum, Microscopy
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
DOI: https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms
Journal Articles

Using Do-It-Yourself Practitioners as Lead Users: A Case Study on the Hair Care Industry

Jaesik Hahn, Amy Marconnet, Tahira Reid
Journal: Journal of Mechanical Design
Article Type: Research-Article
J. Mech. Des. October 2016, 138(10): 101107.
Paper No: MD-16-1052
DOI: https://doi.org/10.1115/1.4034086
Published Online: August 30, 2016
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Topics: Damage, Design, Heat, Patents, Temperature, Engineers
Proceedings Papers

Integrating Design Methodology, Thermal Sciences, and Customer Needs to Address Challenges in the Hair Care Industry

Jaesik Hahn, Tikyna Dandridge, Priya Seshadri, Amy Marconnet, Tahira Reid
Proc. ASME. IDETC-CIE2015, Volume 7: 27th International Conference on Design Theory and Methodology, V007T06A039, August 2–5, 2015
Paper No: DETC2015-46551
DOI: https://doi.org/10.1115/DETC2015-46551
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Topics: Design methodology, Damage, Heat, Data collection, Design, Engineers, Temperature
Proceedings Papers

Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances

Yash Ganatra, Amy Marconnet
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A064, July 6–9, 2015
Paper No: IPACK2015-48499
DOI: https://doi.org/10.1115/IPACK2015-48499
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Topics: Phase change materials, Thermal management, Energy dissipation, Heat, Temperature, Thermal conductivity, Density, Energy consumption, Flow (Dynamics), Heat capacity
Proceedings Papers

Hydrodynamic and Thermal Performance of a Vapor-Venting Microchannel Copper Heat Exchanger

Milnes P. David, Amy Marconnet, Kenneth E. Goodson
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 1363-1370, June 23–25, 2008
Paper No: ICNMM2008-62269
DOI: https://doi.org/10.1115/ICNMM2008-62269
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Topics: Copper, Heat exchangers, Microchannels, Vapors, Membranes, Pressure drop, Thermal resistance, Carbon fibers, Condensation, Convection