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Andreas Schubert
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Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997
Paper No: IMECE1997-1236
DOI: https://doi.org/10.1115/IMECE1997-1236
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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
DOI: https://doi.org/10.1115/IMECE1997-0508
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches

Jürgen Auersperg, Eva Kieselstein, Andreas Schubert, Bernd Michel
Proc. ASME. IMECE2001, Threaded and Riveted Connections, Design Issues, Reliability, Stress Analysis, and Failure Prevention, 89-94, November 11–16, 2001
Paper No: IMECE2001/DE-25109
DOI: https://doi.org/10.1115/IMECE2001/DE-25109
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Topics: Electronic packages, Flip-chip assemblies, Fracture (Process), Fracture mechanics, Fracture toughness, Reliability, Thermomechanics, Delamination, Damage, Fatigue
Proceedings Papers

Large Thrust Bearing Modeling: Influence of Thermal Boundary Conditions and Runner Deformations on Results of TEHD Analysis

Michal Wodtke, Michel Fillon, Andreas Schubert, Michal Wasilczuk
Proc. ASME. IJTC2011, ASME/STLE 2011 Joint Tribology Conference, 143-145, October 24–26, 2011
Paper No: IJTC2011-61109
DOI: https://doi.org/10.1115/IJTC2011-61109
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Topics: Boundary-value problems, Deformation, Modeling, Thrust bearings, Bearings, Computer simulation, Heat transfer coefficients, Hydropower
Proceedings Papers

Indirect Approach to Ultrasonic Superposition in Micro-EDM

Andreas Schubert, Nicolas Wolf, Henning Zeidler, Jo¨rg Schneider
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 1, 427-434, June 13–17, 2011
Paper No: MSEC2011-50240
DOI: https://doi.org/10.1115/MSEC2011-50240
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Topics: Electrical discharge machining, Vibration, Brittleness, Fracture toughness, Geometry, Machining, Mass production, Particulate matter, Resonance, Vibration equipment