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Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Proceedings Papers

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Tsgereda Alazar, Kyle Yazzie, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A048, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67145
https://doi.org/10.1115/IMECE2016-67145
View Paper titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
Open the PDF for Characterization of Bulk and Thin Film Fracture in Electronic Packaging in another window
Topics: Electronic packaging, Fracture (Materials), Thin films, Fracture toughness, Packaging, Epoxy resins, Testing, Blades, Dimensions, Failure