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Proceedings Papers

On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

Sukrut Prashant Phansalkar, Bongtae Han, Ehsan Akbari, Paulius Vaitiekunas
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97719
https://doi.org/10.1115/IPACK2022-97719
View Paper titled, On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)
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Topics: Filled polymers, Viscoelasticity
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
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Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints
Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74058
https://doi.org/10.1115/IPACK2017-74058
View Paper titled, Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System
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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics
Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
https://doi.org/10.1115/1.4035598
Published Online: January 16, 2017
View Article titled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure
Journal Articles

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Kenny Mahan, David Rosen, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041003.
Paper No: EP-16-1046
https://doi.org/10.1115/1.4034454
Published Online: September 2, 2016
View Article titled, Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
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Topics: Adhesion, Deflection, Pressure, Testing, Polymer films, Copper, Delamination
Journal Articles

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Kenny Mahan, Yong Sun, Bongtae Han, Sungwon Han, Mike Osterman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031004.
Paper No: EP-13-1084
https://doi.org/10.1115/1.4026922
Published Online: May 5, 2014
View Article titled, Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth
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Topics: Adhesion, Coating processes, Coatings, Testing, Urethane elastomers, Pressure
Journal Articles

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011013.
Paper No: EP-13-1091
https://doi.org/10.1115/1.4026626
Published Online: February 18, 2014
View Article titled, Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
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Topics: Boiling, Polymers, Temperature, Water, Weight (Mass), Glass transition, Absorption
Proceedings Papers

Comprehensive Quantification of Sorption Characteristics in Polymer Material of Thin Film Form

Heejin Park, Ji-Hyuk Lim, Suk-Jin Ham, Bongtae Han
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 949-955, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-63339
https://doi.org/10.1115/IMECE2011-63339
View Paper titled, Comprehensive Quantification of Sorption Characteristics in Polymer Material of Thin Film Form
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Topics: Permeability, Polymers, Sorption, Thin films
Proceedings Papers

Nano-Pattern Recognition and Correlation Technique for Nano-Scale Deformation Measurement

Hongbo Bi, Chris Hartsough, Bongtae Han
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 831-838, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33717
https://doi.org/10.1115/IPACK2007-33717
View Paper titled, Nano-Pattern Recognition and Correlation Technique for Nano-Scale Deformation Measurement
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Topics: Deformation, Nanoscale phenomena
Proceedings Papers

Thermofluid Characteristics of Two-Phase Microgap Coolers

Dae W. Kim, Emil Rahim, Avram Bar-Cohen, Bongtae Han
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 389-398, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33927
https://doi.org/10.1115/IPACK2007-33927
View Paper titled, Thermofluid Characteristics of Two-Phase Microgap Coolers
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Topics: Coolers, Thermofluids, Boiling, Flow (Dynamics), Water, Heat transfer, Computer simulation, Pressure drop
Proceedings Papers

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Bongtae Han, Seungbae Park, Samson Yoon
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 749-755, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33142
https://doi.org/10.1115/IPACK2007-33142
View Paper titled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Topics: Diffusion (Physics), Microelectronic devices, Temperature
Proceedings Papers

A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance

Li Sun, Shawn Cunningham, Art Morris, Changsoo Jang, Bongtae Han
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 205-211, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67452
https://doi.org/10.1115/IMECE2008-67452
View Paper titled, A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance
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Topics: Flip-chip, Microelectromechanical systems, Packaging, Finite element analysis, Warping, Capacitance, Computer simulation, Design, Displacement, Interferometry
Proceedings Papers

An Advanced Real-Time Moire´ Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder

Seungmin Cho, Changsoo Jang, Bongtae Han
Proc. ASME. IMECE2007, Volume 10: Mechanics of Solids and Structures, Parts A and B, 479-487, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43698
https://doi.org/10.1115/IMECE2007-43698
View Paper titled, An Advanced Real-Time Moire´ Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder
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Topics: Cooling, Creep, Heating, Interferometry, Solders, Solder joints, Constitutive equations, Convection, Cycles, Deformation
Proceedings Papers

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability

Eric Stellrecht, Bongtae Han, Michael Pecht
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 497-503, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35252
https://doi.org/10.1115/IPACK2003-35252
View Paper titled, Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability
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Topics: Proton exchange membranes, Reliability
Proceedings Papers

Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement

Soonwook Kwon, Yuri Lee, Bongtae Han
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 537-542, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35325
https://doi.org/10.1115/IPACK2003-35325
View Paper titled, Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement
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Topics: Alloys, Shear (Mechanics), Solders, Testing, Continuum mechanics, Deformation, Finite element methods, Finite element model, Geometry, Machinery
Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
https://doi.org/10.1115/1.2912181
Published Online: May 14, 2008
View Article titled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion
Journal Articles

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Seungbae Park, Bongtae Han, Samson Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011004.
https://doi.org/10.1115/1.2837521
Published Online: January 31, 2008
View Article titled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Topics: Diffusion (Physics), Temperature, Transients (Dynamics), Finite difference methods
Journal Articles

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Samson Yoon, Bongtae Han, Zhaoyang Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 421–426.
https://doi.org/10.1115/1.2804090
Published Online: April 24, 2007
View Article titled, On Moisture Diffusion Modeling Using Thermal-Moisture Analogy
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Topics: Diffusion (Physics)
Journal Articles

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Seungmin Cho, Bongtae Han, Mem. ASME, Jinwon Joo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 41–47.
https://doi.org/10.1115/1.1646426
Published Online: April 30, 2004
View Article titled, Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
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Topics: Ceramics, Deformation, Manufacturing, Solders, Temperature, Interferometry, Ball-Grid-Array packages, Stress, Displacement