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Proceedings Papers

MEMS Enabled Micro Spray Cooling System for Thermal Control of Electronic Chips

S. C. Yao, C. H. Amon, K. Gabriel, P. Kumta, J. Y. Murthy, C. F. Wu, C. C. Hsieh, D. Boyalakuntla, S. V. J. Narumanchi, K. Rebello
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 181-192, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24392
https://doi.org/10.1115/IMECE2001/HTD-24392
View Paper titled, MEMS Enabled Micro Spray Cooling System for Thermal Control of Electronic Chips
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Topics: Cooling systems, Microelectromechanical systems, Sprays, Cooling, Fluids, Drops, Nozzles, Flux (Metallurgy), Heat, Silicon
Proceedings Papers

Assessment of Fourier-Based Thermal Models Used in Frequency-Domain Thermoreflectance Data Analysis

D. P. Sellan, V. Mishra, J. A. Malen, A. J. H. McGaughey, C. H. Amon
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 683-686, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75087
https://doi.org/10.1115/MNHMT2012-75087
View Paper titled, Assessment of Fourier-Based Thermal Models Used in Frequency-Domain Thermoreflectance Data Analysis
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Topics: Thermoreflectance, Phonons, Heat conduction, Relaxation (Physics), Temperature, Temperature profiles
Proceedings Papers

Predicting the Phonon Properties of Carbon Nanotubes Using the Spectra Energy Density

J. A. Thomas, J. E. Turney, R. M. Iutzi, A. J. H. McGaughey, C. H. Amon
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 305-312, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22262
https://doi.org/10.1115/IHTC14-22262
View Paper titled, Predicting the Phonon Properties of Carbon Nanotubes Using the Spectra Energy Density
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Topics: Carbon nanotubes, Density, Phonons, Spectra (Spectroscopy), Simulation, Water, Atoms, Composite materials, Molecular dynamics, Molecular dynamics simulation
Proceedings Papers

Increasing Efficiencies of Thermoelectric Devices Through Angular Interface Geometries

D. P. Sellan, C. H. Amon
Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 1, 781-789, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ES2009-90058
https://doi.org/10.1115/ES2009-90058
View Paper titled, Increasing Efficiencies of Thermoelectric Devices Through Angular Interface Geometries
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Topics: Acoustics, Germanium, Phonons, Silicon, Simulation results, Thermal conductivity, Thermoelectric devices, Thin films
Proceedings Papers

Critically Assessing the Application of Quantum Corrections to Classical Thermal Conductivity Predictions

J. E. Turney, A. J. H. McGaughey, C. H. Amon
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 139-143, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88129
https://doi.org/10.1115/HT2009-88129
View Paper titled, Critically Assessing the Application of Quantum Corrections to Classical Thermal Conductivity Predictions
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Topics: Thermal conductivity, Flux (Metallurgy), Lattice dynamics, Molecular dynamics, Silicon, Simulation, Temperature
Proceedings Papers

Thin Film Thermal Conductivity by Anharmonic Lattice Dynamics Calculations

J. E. Turney, A. J. H. McGaughey, C. H. Amon
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 1195-1197, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66697
https://doi.org/10.1115/IMECE2008-66697
View Paper titled, Thin Film Thermal Conductivity by Anharmonic Lattice Dynamics Calculations
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Topics: Lattice dynamics, Thermal conductivity, Thin films, Phonons, Crystals, Film thickness, Mode shapes, Molecular dynamics simulation
Proceedings Papers

Effects of Confinement and Surface Reconstruction on the Lattice Dynamics and Thermal Transport Properties of Thin Films

Joseph E. Turney, A. J. H. McGaughey, C. H. Amon
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 789-797, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32274
https://doi.org/10.1115/HT2007-32274
View Paper titled, Effects of Confinement and Surface Reconstruction on the Lattice Dynamics and Thermal Transport Properties of Thin Films
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Topics: Lattice dynamics, Thin films, Phonons, Silicon, Density, Film thickness, Temperature
Proceedings Papers

Argon Thermal Conductivity by Anharmonic Lattice Dynamics Calculations

J. E. Turney, A. J. H. McGaughey, C. H. Amon
Proc. ASME. HT2008, Heat Transfer: Volume 1, 345-347, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56146
https://doi.org/10.1115/HT2008-56146
View Paper titled, Argon Thermal Conductivity by Anharmonic Lattice Dynamics Calculations
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Topics: Lattice dynamics, Thermal conductivity, Phonons, Temperature, Crystals, Low temperature, Melting point, Mode shapes, Molecular dynamics simulation
Proceedings Papers

Design of Direct Methanol Micro Fuel Cell Fluidic Systems

S. C. Yao, G. K. Fedder, C. H. Amon, C. C. Hsieh, X. Tang, Y. Alyousef
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 431-436, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32567
https://doi.org/10.1115/IMECE2002-32567
View Paper titled, Design of Direct Methanol Micro Fuel Cell Fluidic Systems
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Topics: Design, Methanol, Micro fuel cells, Bubbles, Carbon dioxide, Flow (Dynamics), Fluid handling, Manufacturing, Microelectromechanical systems, Microfluidics
Journal Articles

The Effect of Asymmetry in Abdominal Aortic Aneurysms Under Physiologically Realistic Pulsatile Flow Conditions

E. A. Finol, ASME Member, Research Assistant Professor,, K. Keyhani, Staff Engineer,, C. H. Amon, ASME Life Fellow, Raymond J. Lane Distinguished Professor,
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Technical Papers
J Biomech Eng. April 2003, 125(2): 207–217.
https://doi.org/10.1115/1.1543991
Published Online: April 9, 2003
View Article titled, The Effect of Asymmetry in Abdominal Aortic Aneurysms Under Physiologically Realistic Pulsatile Flow Conditions
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Topics: Aneurysms, Flow (Dynamics), Hemodynamics, Pressure, Pulsatile flow, Shear stress, Vortices, Stress, Aorta, Reynolds number
Journal Articles

Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 2: Thermomechanical Models of Adjacent Droplets

R. K. Chin, Graduate Student, J. L. Beuth, Associate Professor, Mem. ASME, C. H. Amon, Professor, Fellow ASME
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. November 2001, 123(4): 632–638.
https://doi.org/10.1115/1.1380200
Published Online: May 1, 2000
View Article titled, Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 2: Thermomechanical Models of Adjacent Droplets
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Topics: Drops, Stress
Journal Articles

Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 1: Thermomechanical Models of Layers and Droplet Columns

R. K. Chin, Graduate Student, J. L. Beuth, Associate Professor, Mem. ASME, C. H. Amon, Professor, Fellow ASME
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. November 2001, 123(4): 623–631.
https://doi.org/10.1115/1.1380199
Published Online: May 1, 2000
View Article titled, Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 1: Thermomechanical Models of Layers and Droplet Columns
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Topics: Drops, Stress, Temperature, Thermomechanics, Simulation, Metals, Engineering simulation
Journal Articles

Shape Deposition Manufacturing With Microcasting: Processing, Thermal and Mechanical Issues

C. H. Amon, J. L. Beuth, L. E. Weiss, R. Merz, F. B. Prinz
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. August 1998, 120(3): 656–665.
https://doi.org/10.1115/1.2830171
Published Online: August 1, 1998
View Article titled, Shape Deposition Manufacturing With Microcasting: Processing, Thermal and Mechanical Issues
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Topics: Manufacturing, Shapes, Metals, Bonding, Drops, Stress, Computer numerical control machine tools, Cooling, Machining, Modeling
Journal Articles

Optimal Three-Dimensional Placement of Heat Generating Electronic Components

M. I. Campbell, C. H. Amon, J. Cagan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 106–113.
https://doi.org/10.1115/1.2792210
Published Online: June 1, 1997
View Article titled, Optimal Three-Dimensional Placement of Heat Generating Electronic Components
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Topics: Electronic components, Heat, Algorithms, Simulated annealing, Computers, Heat transfer, Temperature
Journal Articles

Oscillatory Momentum Transport Mechanisms in Transitional Complex Geometry Flows

D. Majumdar, C. H. Amon
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. March 1997, 119(1): 29–35.
https://doi.org/10.1115/1.2819114
Published Online: March 1, 1997
View Article titled, Oscillatory Momentum Transport Mechanisms in Transitional Complex Geometry Flows
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Topics: Flow (Dynamics), Geometry, Momentum, Shear stress, Computer simulation, Energy dissipation, Energy transformation, Kinetic energy, Pressure, Reynolds number
Journal Articles

Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet

C. H. Amon, K. S. Schmaltz, R. Merz, F. B. Prinz
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1996, 118(1): 164–172.
https://doi.org/10.1115/1.2824030
Published Online: February 1, 1996
View Article titled, Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet
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Topics: Bonding, Drops, Manufacturing, Metals, Computer simulation, Temperature, Cooling, Heat transfer, Solidification, Analytical methods
Journal Articles

Time-Dependent Conjugate Heat Transfer Characteristics of Self-Sustained Oscillatory Flows in a Grooved Channel

J. S. Nigen, C. H. Amon
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. September 1994, 116(3): 499–507.
https://doi.org/10.1115/1.2910305
Published Online: September 1, 1994
View Article titled, Time-Dependent Conjugate Heat Transfer Characteristics of Self-Sustained Oscillatory Flows in a Grooved Channel
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Topics: Flow (Dynamics), Heat transfer, Heat, Convection, Cooling, Design, Heat conduction, Heat exchangers, Heat flux, Reynolds number
Journal Articles

Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows

J. S. Nigen, C. H. Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 356–365.
https://doi.org/10.1115/1.2909344
Published Online: December 1, 1993
View Article titled, Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows
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Topics: Cooling, Electronic packages, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Bifurcation, Computer simulation, Design, Heat, Poiseuille flow
Journal Articles

Heat and Momentum Transport in Self-Sustained Oscillatory Viscous Flows

D. Majumdar, C. H. Amon
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1992, 114(4): 866–873.
https://doi.org/10.1115/1.2911894
Published Online: November 1, 1992
View Article titled, Heat and Momentum Transport in Self-Sustained Oscillatory Viscous Flows
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Topics: Flow (Dynamics), Heat, Heat transfer, Momentum, Reynolds number, Computer simulation, Convection, Fluctuations (Physics), Forced convection, Oscillations
Journal Articles

Heat Transfer Enhancement by Flow Destabilization in Electronic Chip Configurations

C. H. Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 35–40.
https://doi.org/10.1115/1.2905439
Published Online: March 1, 1992
View Article titled, Heat Transfer Enhancement by Flow Destabilization in Electronic Chip Configurations
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Topics: Flow (Dynamics), Heat transfer, Computer simulation, Convection, Cooling systems, Design, Energy dissipation, Oscillations, Reynolds number, Traveling waves