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Proceedings Papers

Selection of Method for Fatigue Life Prediction Under Random Loading

Amit Awasthi, Stephen Mckeown, C. Sahay, Bahgat Sammakia
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 289-304, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24738
https://doi.org/10.1115/IMECE2001/EPP-24738
View Paper titled, Selection of Method for Fatigue Life Prediction Under Random Loading
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Topics: Algorithms, Aluminum, Copper, Cycles, Electronic packages, Fatigue, Fatigue failure, Fatigue life, Fatigue testing, Gaussian distribution
Proceedings Papers

On Tool Instability During Machining

C. Sahay, R. N. Dubey
Proc. ASME. DETC91, 13th Biennial Conference on Mechanical Vibration and Noise: Vibration Analysis — Analytical and Computational, 199-203, September 22–25, 1991
Publisher: American Society of Mechanical Engineers
Paper No: DETC1991-0335
https://doi.org/10.1115/DETC1991-0335
View Paper titled, On Tool Instability During Machining
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Topics: Machining, Cutting, Vibration, Dimensions, Shear deformation
Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

Scott Anson, C. Sahay, Linda Head, James Constable
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 94–100.
https://doi.org/10.1115/1.2792138
Published Online: June 1, 1996
View Article titled, Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
Open the PDF for Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach in another window
Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure
Journal Articles

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 230–234.
https://doi.org/10.1115/1.2792097
Published Online: September 1, 1995
View Article titled, Study of Print Release Process in Solder Paste Printing
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Topics: Printing, Solders, Shear strength, Boundary layers, Density, Dimensions, Reflow soldering, Separation (Technology), Shear (Mechanics), Surface mount technology