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1-11 of 11
Changsoo Jang
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011013.
Paper No: EP-13-1091
Published Online: February 18, 2014
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 31-36, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33214
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 749-755, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33142
Proceedings Papers
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 205-211, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67452
Proceedings Papers
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 1-8, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42079
Proceedings Papers
Proc. ASME. IMECE2007, Volume 10: Mechanics of Solids and Structures, Parts A and B, 479-487, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43698
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
Published Online: November 17, 2008
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
Published Online: May 14, 2008
Proceedings Papers
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 131-138, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59155
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011004.
Published Online: January 31, 2008
Proceedings Papers
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 467-477, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16255